A radio-frequency signal amplifier

Abstract

The invention relates to a signal amplifier (10) configured to process an input signal at a first power level so as to obtain an output signal at a second power level higher than said first power level. Accordingly, the signal amplifier (10) is characterized in that it comprises a portable housing (11 ), a signal amplification circuit (12) provided in the housing (11 ) and configured to amplify the input signal from the first power level to the second power level, and a plurality of heat-dissipation elements (13) extending outwardly from a surface of the housing (11 ), the heat-dissipation elements (13) being configured to dissipate the heat generated during conversion of the input signal at the first power level into the output signal at the second power level.

Description

[0001] A RADIO-FREQUENCY SIGNAL AMPLIFIER

[0002] TECHNICAL FIELD

[0003] The invention relates to a signal amplifier configured to process an input signal at a first power level and generate an output signal at a second power level that is higher than said first power level.

[0004] PRIOR ART

[0005] In electronic devices — especially in systems with high power consumption such as signal amplifiers — heat is generated due to energy loss during the signal amplification process. Signal amplifiers are fundamental components that convert a low-power input signal into a high-power output signal. However, during this process, a certain amount of energy is lost as current flows through resistors, semiconductor materials, and other components within the circuit, and this lost energy is converted into heat.

[0006] The heat generated in this manner can negatively affect the overall performance, operational stability, and long-term reliability of the device. Elevated temperatures may cause rapid degradation of electronic components, reduced efficiency, and even system failure if thermal limits are reached.

[0007] Various cooling solutions are used in existing systems to reduce heat in signal amplifiers. Commonly employed cooling methods include external heat sinks, passive cooling components, active fan systems, and materials that enhance thermal conductivity. However, each of these systems presents certain disadvantages.

[0008] External heat sinks are typically designed as metallic fins or heat-dissipating structures mounted on top of the amplifier. Although effective to a degree, their size and weight increase the overall dimensions of the device and complicate the assembly process. This creates significant design challenges, particularly for compact and portable devices where space and weight constraints are critical.

[0009] In some systems, active cooling solutions such as external fans or liquid-cooling modules are preferred. Fan-based cooling systems help remove heat from the deviceby directing airflow across heat-dissipating surfaces. However, this approach increases power consumption and, due to the presence of moving components, is prone to wear and mechanical failure over time.

[0010] Liquid-cooling systems offer higher cooling efficiency, but they also introduce disadvantages such as high cost, complex assembly requirements, and the potential risk of fluid leakage.

[0011] Existing cooling systems present several fundamental challenges in terms of integration with signal amplifiers. Adding cooling components as external units increases the overall size and weight of the device, raises production costs, and makes assembly processes more complex. Moreover, cooling systems manufactured as independent components may not achieve full compatibility with the amplifier, which can lead to reduced thermal efficiency. This, in turn, may negatively affect the longterm durability and reliability of the device.

[0012] Consequently, all of the issues described above have made it necessary to introduce an innovation in the relevant technical field.

[0013] BRIEF DESCRIPTION OF THE INVENTION

[0014] The present invention relates to a signal amplifier designed to eliminate the disadvantages mentioned above and to provide new advantages in the relevant technical field.

[0015] An objective of the invention is to provide a signal amplifier that enables effective dissipation of heat generated while an input signal is amplified to a higher power level.

[0016] Another objective of the invention is to provide a signal amplifier that ensures sufficient heat removal for the dissipation of heat generated during the amplification of an input signal to a higher power level.

[0017] To achieve all of the objectives mentioned above and those that will become apparent from the detailed description below, the present invention is a signal amplifier configured to process an input signal at a first power level so as to obtain an output signal at a second power level higher than the first power level.Accordingly, the invention comprises a portable housing, a signal amplification circuit provided in the housing and configured to amplify the input signal from the first power level to the second power level, and a plurality of heat-dissipation elements provided to extend outwardly from a surface of the housing, the heat-dissipation elements being configured to dissipate the heat generated during conversion of the input signal at the first power level into the output signal at the second power level.

[0018] A feature of a possible embodiment of the invention is that the heat-dissipation elements have a rectangular cross-section.

[0019] A feature of another possible embodiment of the invention is that the heat-dissipation elements are arranged at equal intervals from one another.

[0020] A feature of another possible embodiment of the invention is that the heat-dissipation elements are manufactured from aluminum.

[0021] A feature of another possible embodiment of the invention is that the housing has a circular form.

[0022] A feature of another possible embodiment of the invention is that the housing comprises a power connection point.

[0023] A feature of another possible embodiment of the invention is that it comprises a cover associated with the housing.

[0024] BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 illustrates a representative exploded view of the signal amplifier.

[0026] DETAILED DESCRIPTION OF THE INVENTION

[0027] In the detailed description that follows, the subject matter of the invention is explained solely by way of examples intended to facilitate understanding and is not to be construed as limiting in any way.

[0028] The invention relates to a signal amplifier (10) configured to process an input signal at a first power level so as to obtain an output signal at a second power level higher thanthe first power level. The signal amplifier (10) comprises a compact structure that includes both a signal amplification mechanism and an integrated cooling mechanism.

[0029] As shown in Figure 1 , the signal amplifier (10) comprises a portable housing (11 ). The housing (11) contains a signal amplification circuit (12) configured to amplify an input signal at a first power level to a higher, second power level. The signal amplification circuit (12) increases the amplitude of the input signal to produce a stronger output signal. This enables the signal amplifier (10) to be used particularly for transmitting low-level signals over longer distances or in applications requiring higher power.

[0030] The signal amplification circuit (12) consists of a specialized structure including conductive traces, as well as active and passive electronic components. It ensures that the input signal is amplified without degrading its accuracy or quality.

[0031] As shown in Figure 1, the signal amplifier (10) includes a plurality of heat-dissipation elements (13) extending outwardly from the surface of the housing (11), configured to dissipate the heat generated while the input signal at the first power level is converted into an output signal at the second power level. These heat-dissipation elements increase thermal efficiency, enable more stable operation of the amplifier, and prevent failures associated with overheating. Thus, the need for external cooling components is eliminated.

[0032] The heat-dissipation elements are provided with a rectangular cross-section. In a preferred embodiment of the invention, the heat-dissipation elements have a square cross-section. The rectangular form increases surface area, thereby enabling heat to be transferred naturally to the air.

[0033] The heat-dissipation elements are arranged at equal intervals. This equal spacing improves airflow and maximizes cooling performance. As a result, thermal management becomes more homogeneous and the formation of hot spots is prevented.

[0034] The heat-dissipation elements are manufactured from aluminum. Aluminum provides high thermal conductivity, durability, and low weight due to its low density. Additionally, its resistance to corrosion contributes to long-term usability.In a possible embodiment of the invention, the housing (11 ) may have a circular form, facilitating ease of assembly for the signal amplifier.

[0035] The housing (11) comprises a power connection point (15). The power connection point (15) includes multiple connection interfaces compatible with various power sources. The housing (11) may also include signal connection elements (16) that interface with these connection points. Owing to the placement configuration of the signal connection elements (16), the circular form of the housing is not disturbed, and no structural modification is required in the mounting area.

[0036] The power connection point (15) enables the signal amplifier (10) to be easily connected to external power sources, thereby providing versatile usability. In another possible embodiment of the invention, the power connection point may be positioned in a manner that preserves the circular form of the housing.

[0037] A cover (14) is provided in association with the housing (11). The cover (14) protects the internal components of the signal amplifier (10) against external influences. In particular, it prevents dust, moisture, and other environmental factors from damaging the internal components, thereby ensuring long-term durability of the system. The cover (14) also enables maintenance operations to be carried out easily.

[0038] The signal amplifier (10) described above provides effective thermal management, enabling devices to operate more reliably and with a longer service life. Efficient dissipation of heat prevents components from overheating, allowing stable, long-term operation without performance degradation. Improved thermal management extends the lifespan of electronic components, reduces maintenance requirements, and minimizes the risk of failure.

[0039] The signal amplifier (10) operates with high efficiency, ensuring that energy losses are minimized and both thermal and electrical performance are improved. Owing to its compact structure, cooling is achieved without increasing the overall size of the device. This preserves portability and simplifies assembly processes.

[0040] As a result, the signal amplifier (10) delivers stable, reliable, and efficient operation, ensuring consistent performance throughout its service life.The scope of protection of the invention is defined in the claims provided in the annex and cannot in any way be limited to the exemplary embodiments described in this detailed explanation. It is evident that a person skilled in the art may devise similar embodiments in light of the foregoing without departing from the essence of the invention.REFERENCE NUMERALS SHOWN IN THE DRAWINGS

[0041] 10 Signal amplifier

[0042] 11 Housing

[0043] 12 Signal amplification circuit

[0044] 13 Heat-dissipation element

[0045] 14 Cover

[0046] 15 Power connection point

[0047] 16 Signal connection element

Claims

CLAIMS1. A signal amplifier (10) configured to process an input signal at a first power level so as to obtain an output signal at a second power level higher than the first power level, characterized in that it comprises: a portable housing (11); a signal amplification circuit (12) provided in the housing (11 ) and configured to amplify the input signal from the first power level to the second power level; and a plurality of heat-dissipation elements (13) extending outwardly from a surface of the housing (11), the heatdissipation elements being configured to dissipate heat generated during conversion of the input signal at the first power level into the output signal at the second power level.

2. A signal amplifier (10) according to Claim 1 , characterized in that the heatdissipation elements (13) have a rectangular cross-section.

3. A signal amplifier (10) according to Claim 1 , characterized in that the heatdissipation elements (13) are arranged at equal intervals from one another.

4. A signal amplifier (10) according to Claim 1 , characterized in that the heatdissipation elements (13) are manufactured from aluminum.

5. A signal amplifier (10) according to Claim 1 , characterized in that the housing (11 ) has a circular form.

6. A signal amplifier (10) according to Claim 1 , characterized in that it comprises a power connection point (15) provided on the housing (11 ).

7. A signal amplifier (10) according to Claim 1 , characterized in that it comprises a cover (14) associated with the housing (11 ).

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