Feedthrough assembly and device including same

Abstract

An assembly may include a dielectric substrate including a first major surface and a second major surface. The assembly further includes a patterned conductive layer disposed on the first major surface of the dielectric substrate that defines an electrode that includes a top surface and a side surface. The assembly further includes a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

Description

Medtronic Ref. No. A0012883 WOO 1 FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAMECROSS-REFERENCE TO RELATED APPLICATIONThis application claims the benefit of U.S. Provisional Application No. 63 / 789,022, filed April 15, 2025, the disclosure of which being incorporated by reference herein in its entirety.TECHNICAL FIELD

[0001] This disclosure generally relates to a feedthrough assembly and more particularly to a device that includes such feedthrough assembly.BACKGROUND

[0002] Various systems require electrical coupling between electrical devices disposed within a sealed enclosure or housing and devices or systems external to the enclosure. Oftentimes, such electrical coupling needs to withstand various environmental factors so that a conductive pathway or pathways from the external surface of the enclosure to within the enclosure remains stable. For example, implantable medical devices (IMDs), e.g., cardiac pacemakers, defibrillators, neurostimulators, and drug pumps, require an enclosure or housing to contain and seal electronic components and one or more power sources within a body of a patient. Many of these IMDs include one or more additional electrical components such as, for example, feedthrough assemblies to provide electrical connections between the electronic components and power sources contained within the housing and components of the IMD external to the housing. Such external components can include at least one or more sensors, electrodes, and lead wires mounted on an exterior surface of the housing, or electrical contacts housed within a connector header, which is mounted on the housing to provide coupling for one or more implantable leads. A feedthrough assembly can include one or more feedthroughs that provide electrical coupling between electrical components disposed within a sealed enclosure or housing and devices or systems external to the enclosure in an electrically insulated and hermetically sealed manner.SUMMARY

[0003] The techniques of this disclosure generally relate to various embodiments of a feedthrough assembly and a device that includes such assembly. The feedthrough assembly can include a patterned anodized layer formed on an electrode defined by a patterned conductive layer that is disposed on a dielectric substrate. The patterned anodized layer can define a first nonconductive portion of the electrode on the top surface of the electrode, a secondMedtronic Ref. No. A0012883 WOO 1 nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode. The patterned anodized layer can assist in electrically isolating adjacent portions of the patterned conductive layer such as between the electrode and a second electrode also defined by the patterned conductive layer.

[0004] In one example, aspects of this disclosure relate to a feedthrough assembly including: a dielectric substrate including a first major surface and a second major surface; a patterned conductive layer disposed on the first major surface of the dielectric substrate and including an electrode that includes a top surface and a side surface; and a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

[0005] In another example, aspects of this disclosure relate to a hermetically-sealed package including a housing and a feedthrough assembly that forms a part of the housing and is hermetically sealed to the housing, wherein the feedthrough assembly includes: a dielectric substrate including a first major surface and a second major surface; a patterned conductive layer disposed on the first major surface of the dielectric substrate and including an electrode that includes a top surface and a side surface; and a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

[0006] In another example, aspects of this disclosure relate to a wafer including: a wafer substrate; and a plurality of feedthrough assemblies disposed on the wafer substrate, wherein each feedthrough assembly includes: a dielectric substrate formed from the wafer substrate and including a first major surface and a second major surface; a patterned conductive layer disposed on the first major surface of the dielectric substrate and including an electrode that includes a top surface and a side surface; and a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

[0007] In another example, aspects of this disclosure relate to a method including: disposing a conductive layer on a first major surface of a dielectric substrate wafer, wherein the dielectric substrate wafer includes the first major surface and a second major surface; selectively bonding the conductive layer to the first major surface of the dielectric substrate wafer; patterning the conductive layer to form a patterned conductive layer on the first major surface of the dielectricMedtronic Ref. No. A0012883 WOO 1 substrate wafer, wherein the patterned conductive layer includes an electrode; and anodizing portions of the patterned conductive layer to form a patterned anodized layer that defines a first nonconductive portion of the electrode on a top surface of the electrode, a second nonconductive portion of the electrode on a side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

[0008] All headings provided herein are for the convenience of the reader and should not be used to limit the meaning of any text that follows the heading, unless so specified.

[0009] The terms “comprises” and variations thereof do not have a limiting meaning where these terms appear in the description and claims. Such terms will be understood to imply the inclusion of a stated step or element or group of steps or elements but not the exclusion of any other step or element or group of steps or elements. The term “consisting of’ means “including” and is limited to whatever follows the phrase “consisting of.” Thus, the phrase “consisting of’ indicates that the listed elements are required or mandatory and that no other elements may be present. The term “consisting essentially of’ means including any elements listed after the phrase and is limited to other elements that do not interfere with or contribute to the activity or action specified in the disclosure for the listed elements. Thus, the phrase “consisting essentially of’ indicates that the listed elements are required or mandatory, but that other elements are optional and may or may not be present depending upon whether or not they materially affect the activity or action of the listed elements.

[0010] The words “preferred” and “preferably” refer to embodiments of the disclosure that may afford certain benefits, under certain circumstances; however, other embodiments may also be preferred, under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful and is not intended to exclude other embodiments from the scope of the disclosure.

[0011] In this application, terms such as “a,” “an,” and “the” are not intended to refer to only a singular entity but include the general class of which a specific example may be used for illustration. The terms “a,” “an,” and “the” are used interchangeably with the term “at least one.” The phrases “at least one of’ and “comprises at least one of’ followed by a list refers to any one of the items in the list and any combination of two or more items in the list.

[0012] As used herein, the term “or” is generally employed in its usual sense including “and / or” unless the content clearly dictates otherwise.

[0013] The term “and / or” means one or all of the listed elements or a combination of any two or more of the listed elements.Medtronic Ref. No. A0012883 WOO 1

[0014] As used herein in connection with a measured quantity, the term “about” refers to that variation in the measured quantity as would be expected by the skilled artisan making the measurement and exercising a level of care commensurate with the objective of the measurement and the precision of the measuring equipment used. Herein, “up to” a number (e.g., up to 50) includes the number (e.g., 50).

[0015] Also herein, the recitations of numerical ranges by endpoints include all numbers subsumed within that range as well as the endpoints (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, 5, etc.).

[0016] The details of one or more aspects of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the techniques described in this disclosure will be apparent from the description and drawings, and from the claims.BRIEF DESCRIPTION OF DRAWINGS

[0017] FIG. l is a schematic perspective view of one embodiment of an implantable medical device (IMD) implanted in a patient.

[0018] FIG. 2 is a schematic perspective view of the IMD of FIG. 1 that includes a feedthrough assembly connected to a housing of the IMD.

[0019] FIG. 3 is a schematic exploded view of the IMD of FIG. 1.

[0020] FIG. 4 is a schematic cross-section view of another embodiment of a feedthrough assembly that can be utilized with the IMD of FIG. 1.

[0021] FIG. 5 is a schematic cross-section view of the feedthrough assembly of FIG. 4 connected to a housing of an IMD.

[0022] FIG. 6 is a schematic top plan view of the feedthrough assembly of FIG. 4.

[0023] FIG. 7 is a schematic cross-section view of an electrode and a portion of a patterned anodized layer of the feedthrough assembly of FIG. 4.

[0024] FIG. 8 is a schematic cross-section view of the feedthrough assembly of FIG. 4 connected to a housing of a hermetically-sealed package.

[0025] FIGS. 9A-F are schematic cross-section views of a technique of forming the feedthrough assembly of FIG. 4, where FIG. 9A illustrates disposing a conductive layer on a substrate wafer that defines a substrate of one or more feedthrough assemblies; FIG. 9B illustrates selectively bonding the conductive layer to the substrate wafer and disposing one or more feedthroughs through the dielectric substrate wafer; FIG. 9C illustrates patterning the conductive layer to form a patterned conductive layer; FIG. 9D illustrates anodizing portions of the patterned conductiveMedtronic Ref. No. A0012883 WOO 1 layer to form a patterned anodized layer; FIG. 9E illustrates singulating the substrate wafer and the patterned conductive layer; and FIG. 9F illustrates separating the singulated substrate wafer and the patterned conductive layer to form two feedthrough assemblies.DETAILED DESCRIPTION

[0026] The techniques of this disclosure generally relate to various embodiments of a feedthrough assembly and a device that includes such assembly. The feedthrough assembly can include a patterned anodized layer formed on an electrode defined by a patterned conductive layer that is disposed on a dielectric substrate. The patterned anodized layer can define a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode. The patterned anodized layer can assist in electrically isolating adjacent portions of the patterned conductive layer such as between the electrode and a second electrode also defined by the patterned conductive layer.

[0027] Feedthroughs are used, for example, in most IMDs to separate a battery and electronics from a body of a patient, and to provide a hermetic path for electrical signals into and out of the devices. High voltage applications present the additional challenge of withstanding hundreds of volts without dielectric breakdown or surface arcing of electrodes or contacts of the IMDs.Although described primarily the context of implantable medical devices, the feedthroughs described throughout this document may be used in non-implantable medical devices and other non-medical devices for similar or other reasons, including sealed electronics and motors in marine environments, high-reliability space electronics, external defibrillator systems, sealed high voltage power packs and power supplies, sealed wearable medical devices, etc.

[0028] One or more embodiments of feedthrough assemblies and devices IMDs that include such assemblies described herein can provide various advantages over currently-available assemblies and devices. In one or more embodiments, two or more feedthrough electrodes of a feedthrough assembly can be selectively anodized to provide a barrier to dielectric breakdown and surface arcing between the electrodes. Further, a flange that can be utilized to connect the feedthrough assembly to a housing of a device such as an IMD can also be selectively anodized to provide a barrier between the flange and adjacent electrodes or other portions of the flange. In one or more embodiments, selective anodization can be applied in a wafer scale process that provides a plurality of feedthroughs assemblies on a dielectric wafer substrate.

[0029] Selective anodization as described herein can provide a high dielectric strength patterned anodized layer that covers adjacent surfaces between electrodes and between one or moreMedtronic Ref. No. A0012883 WOO 1 electrodes and the flange. Also, the anodization process can provide an anodized layer having an increased thickness on portions of the electrodes where the largest electrical fields are present, thereby providing additional protection against breakdown and arcing. Selective anodization can also allow contact or weld surfaces of electrodes and flanges to remain un-anodized so that additional components or circuitry can be electrically connected to them. The patterned anodized layer formed by selective anodization can remain chemically stable in harsh processing environments and in vivo. This patterned layer may also allow for closer spacing of electrodes than can currently be provided using traditional techniques that rely on Dadet, silicone, or parylene coatings for insulation between conductive elements of the assembly.

[0030] FIG. l is a schematic perspective view of an embodiment of an implantable medical device (IMD) 10 implanted in a patient 2. The IMD 10 includes a housing 12, which can also be referred to as a case. The housing 12 can define an internal volume of the IMD 10 and can house one or more internal components, such as one or more power sources, electronic components, circuitry, and the like.

[0031] The IMD 10 can be configured to be electrically connectable with one or more external components, such as a medical lead 14. The one or more external components can be electrically connected to the one or more internal components via a feedthrough, which can be positioned in a connector header 16. The connector header 16 can form a unitary part with, or can be coupled to, the housing 12. The connector header 16 can be configured to receive the one or more external components, such as the lead 14. For example, the connector header 16 can define a bore into which a portion of the lead 14 can be inserted. The lead 14 can have electrical contacts that electrically couple with respective electrical contacts in the connector header 16 when the lead is inserted into the bore. The electrical contacts in the connector header 16 can be electrically coupled to the electrical components of the IMD 10 through one or more feedthroughs.

[0032] Various schematic views of an illustrative embodiment of the IMD 10 (without the connector header 16) that can utilize one or more embodiments of feedthrough assemblies described herein are shown in FIGS. 2-3. The IMD 10 can include the housing 12 and a feedthrough assembly 30 connected to the housing using any suitable technique. The housing 12 can include an inner surface 18 and an outer surface 20. The IMD 10 can also include one or more internal electronic components 22 disposed in the housing 12, such as at least one electronic device 24 and / or a power source 26. In one or more embodiments, the electronic device 24 and the power source 26 can be disposed within an internal volume 28 of the housing 12. The power source 26 can include one or more power source contacts that can be operativelyMedtronic Ref. No. A0012883 WOO 1 coupled to at least one of the electronic device 24 or one or more feedthrough pins 64 of a feedthrough 34 of feedthrough assembly 30.

[0033] The IMD 10 can include any suitable electronic components 22, e.g., sensing circuitry for sensing electrical activity via electrodes and therapy generation circuitry for delivering electrical stimulation therapy via the electrodes. The electronic components 22 can include any discrete and / or integrated electronic circuit components that implement analog and / or digital circuits capable of producing the functions attributed to the IMD 10. In one or more embodiments, the electronic components 22 can include one or more sensors for sensing other physiological parameters, such as acceleration, pressure, sound, and / or impedance. Additionally, the housing 12 can also house a memory that includes instructions that, when executed by processing circuitry housed within the housing or external to the housing, cause the IMD 10 to perform various functions attributed to the device herein. In one or more embodiments, the housing 12 can house communication circuitry that enables the IMD 10 to communicate with other electronic devices, such as a medical device programmer. In one or more embodiments, the housing 12 can also house an antenna for wireless communication.

[0034] The feedthrough assembly 30 can include a ferrule or substrate 40 and one or more feedthroughs 34 each disposed in a via 36 defined by the substrate. The IMD 10 can include any suitable feedthrough assembly 30 that is connected to the housing 12 of the IMD using any suitable technique, e.g., laser welding, bonding, diffusion bonding, laser assisted diffusion bonding, adhering, mechanically fastening, soldering, plasma arc welding, etc.

[0035] For example, FIG. 4 is a schematic cross-section view of another embodiment of a feedthrough assembly 130 that can be utilized with the IMD 10 of FIGS. 1-3. All design considerations and possibilities described herein regarding feedthrough assembly 30 of FIGS. 2-3 apply equally to feedthrough assembly 130 of FIG. 4 unless stated otherwise. The feedthrough assembly 130 includes a dielectric substrate 140 having a first major surface 142 and a second major surface 144. A patterned conductive layer 146 is disposed on the first major surface 142 of the dielectric substrate 140 and includes one or more electrodes 148, where each electrode includes a top surface 150 and a side surface 152 (as shown in FIGS. 6-7). The assembly 130 further includes a patterned anodized layer 154 formed on the electrode 148 that defines a first nonconductive portion 156 of the electrode on the top surface 150 of the electrode 148, a second nonconductive portion 158 of the electrode on the side surface 152 of the electrode, and a conductive portion 160 of the electrode on the top surface 150 of the electrode 148.

[0036] The feedthrough assembly 130 can be any suitable feedthrough assembly that can be utilized with any suitable device or system. In one or more embodiments, the feedthroughMedtronic Ref. No. A0012883 WOO 1 assembly 130 can be connected to a housing of an IMD and form at least a portion of the housing or enclosure of the device (e.g., housing 12 of IMD 10 of FIGS. 1-3) that houses one or more electronic components (e.g., electronic components 22) that can be utilized for providing one or more therapies to a patient.

[0037] The dielectric substrate 140 of the feedthrough assembly 130 can include any suitable material. In one or more embodiments, the substrate 140 can include a dielectric material, e.g., at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, or gallium nitride. Further, the substrate 140 can include at least one of a biocompatible material or one or more coatings or layers that can provide biocompatibility.

[0038] In one or more embodiments, the substrate 140 can be a transparent substrate. As used herein, the phrase “transparent substrate” refers to a substrate that can transmit a given percentage of electromagnetic radiation incident thereon during use of laser bonding techniques described herein to preferentially heat only a major surface of the substrate (e.g., first major surface 142 or second major surface 144 of substrate 140), and not an inner bulk of the substrate, thereby creating a bond that has a relatively greater strength than the bulk strength of the substrate. In one or more embodiments, the substrate 140 can be substantially transparent at a desired wavelength or range of wavelengths. As used herein, the phrase “substantially transparent” means that the substrate transmits greater than 50% of electromagnetic radiation incident on the substrate for a selected wavelength or range of wavelengths, assuming no reflection at the air-substrate boundaries. In one or more embodiments, the substrate 140 can be substantially transmissive to electromagnetic radiation having a wavelength of at least 200 nm. In one or more embodiments, the substrate 140 can be substantially transmissive to electromagnetic radiation having a wavelength of greater than 10,000 nm. In one or more embodiments, the substrate 140 can be substantially transmissive to electromagnetic radiation having a wavelength in a range of 200 nm to 10,000 nm. In one or more embodiments, the substrate 140 can be substantially transmissive to at least one of UV light, visible light, or IR light.

[0039] The substrate 140 can include any suitable dimensions, e.g., thicknesses. Further, the substrate 140 can take any suitable shape, and each of the first and second major surfaces 142, 144 can take any suitable shape and have any suitable dimensions. In one or more embodiments, at least one of the first or second major surfaces 142, 144 can take a substantially planar shape. The substrate 140 can be a single, unitary substrate or multiple substrates joined together using any suitable technique.

[0040] Disposed on or adjacent the first major surface 142 of the dielectric substrate 140 is the patterned conductive layer 146. Although referred to herein as the patterned conductive layerMedtronic Ref. No. A0012883 WOO 1 146, such layer can include one or more nonconductive layers or materials as well. In one or more embodiments, one or more nonconductive layers can be disposed between the patterned conductive layer 146 and the first major surface 142 of the substrate. The patterned conductive layer 146 can include any suitable conductive or nonconductive material, e.g., at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, Kovar, or nickel. In one or more embodiments, the patterned conductive layer 146 can include a foil or foils disposed on the first major surface 142 of the substrate 140 using any suitable technique. The patterned conductive layer 146 can include any suitable layers or sublayers.

[0041] The patterned conductive layer 146 can have any suitable dimensions. In one or more embodiments, the patterned conductive layer 146 can have a thickness measured in a direction orthogonal to the first major surface 142 of the substrate 140 of at least 50 micrometers and no greater than 150 micrometers. The patterned conductive layer 146 can have a uniform thickness or one or more portions that have thicknesses that are different from thicknesses of adjacent portions.

[0042] Further, the patterned conductive layer 146 can be disposed in any suitable pattern. In one or more embodiments, one or more portions of the patterned conductive layer 146 can include or define one or more electrodes 148 disposed on or at least partially within the first major surface 142 of the dielectric substrate 140. Further, one or more portions of the patterned conductive layer 146 can define one or more flanges 162 that can be utilized to connect the assembly 130 to a housing of a hermetically-sealed package or device (e.g., hermetically-sealed package 200 of FIG. 8).

[0043] Any suitable technique can be utilized to dispose the patterned conductive layer 146 on or adjacent the first major surface 142 of the dielectric substrate 140. For example, the patterned conductive layer 146 can be disposed on or adjacent the first major surface 142 utilizing one or more of photolithography, etching, plasma vapor deposition, chemical vapor deposition, electroplating, laser bonding, etc.

[0044] Further, the patterned conductive layer 146 can be connected to the first major surface 142 of the substrate 140 using any suitable technique, e.g., welding, laser welding, laser bonding, diffusion bonding, laser-assisted diffusion bonding, etc., to form one or more bonds 166 between portions of the patterned conductive layer and the first major surface. In one or more embodiments, the patterned conductive layer 146 can be connected to the first major surface 142 using the laser diffusion bonding techniques described in co-owned U.S. Patent No. 10,124,559 B2, entitled KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURESMedtronic Ref. No. A0012883 WOO 1 AND METHODS to form one or more laser bonds 166. For example, electromagnetic radiation (e.g., light) can be directed through the second major surface 144 of the dielectric substrate 140 and focused at an interface between the patterned conductive layer 146 and the first major surface 142 to form the laser bonds 166. In embodiments where an interlayer is present, the electromagnetic radiation can be focused at an interface between the interlayer and the first major surface 142.

[0045] Any suitable electromagnetic radiation can be utilized to form a bond between one or more portions of the patterned conductive layer 146 and the first major surface 142 of the dielectric substrate 140. In one or more embodiments, the electromagnetic radiation can include laser light that can include any suitable wavelength or range of wavelengths. In one or more embodiments, the laser light can include light having a wavelength of at least 200 nm. In one or more embodiments, the laser light can include a wavelength of no greater than 10,000 nm. For example, laser light can include UV light, visible light, IR light, and combinations thereof. In one or more embodiments, a UV laser can be utilized to provide light having a wavelength of about 350 nm and a pulse width of 30 ns. In one or more embodiments, the materials for the substrate 140 and the patterned conductive layer 146, and the power level and wavelength of the light used may be selected such that the light may not directly damage, ablate, warp, or cut the substrate and the patterned conductive layer, and such that the substrate and the patterned conductive layer retain their bulk properties.

[0046] In general, light can be provided by any suitable laser or laser system. For example, the laser may generate light having a relatively narrow set of wavelengths (e.g., a single wavelength). The light emitted by the laser may form a collimated beam that may not be focused at a particular point. The light emitted by the laser may be focused at interfaces between the patterned conductive layer 146 and the first major surface 142 to generate a laser bond.

[0047] Although the laser may provide light that has a narrow range of wavelengths, in one or more embodiments, the laser may represent one or more devices that emit light having a wider range of wavelengths than a single typical laser. A wide variety of devices may be used to emit light having a narrow or wide range of wavelengths. In one or more embodiments, the laser may include one or more laser devices including diode and fiber lasers. Laser sources may also include, e.g., Ti sapphire, argon ion, Nd: YAG, XeF, HeNe, Dye, GaAs / AlGaAs, CO2, Alexandrite, InGaAs, InGaAsP, Nd:glass, Yb:YAG, or Yb fiber lasers. The laser device may also include one of continuous wave, modulated, or pulsed modes. Accordingly, a wide variety of laser devices may be used in the bonding process. In one or more embodiments, a power level ofMedtronic Ref. No. A0012883 WOO 1 the laser may be set to approximately 1 W, distributed across the approximate focused beam diameter of 10 pm, with a top hat or Gaussian spatial energy profile.

[0048] In one or more embodiments, the patterned conductive layer 146 can define a first patterned conductive layer, and the assembly 130 can include a second patterned conductive layer 168 disposed on or adjacent the second major surface 144 of the dielectric substrate 140. The second patterned conductive layer 168 can include any suitable patterned conductive layer, e.g., patterned conductive layer 146. In one or more embodiments, one or more portions of the second patterned conductive layer 168 can define one or more internal electrodes or contacts 170. The same design characteristics and possibilities described herein regarding the first patterned conductive layer 146 can be applied to the second patterned conductive layer 168 unless stated otherwise. In one or more embodiments, the second patterned conductive layer 168 can be weldable, solderable, etc.

[0049] As stated herein, the patterned conductive layer 146 can include any suitable number of layers. For example, the patterned conductive layer 146 can include a conductive sublayer and an interlayer (not shown) disposed between the conductive sublayer and the first major surface 142 of the substrate 140. The interlayer can include any suitable material, e.g., titanium, niobium, tantalum, zirconium, and alloys thereof. Further, the interlayer can have any suitable dimensions. In one or more embodiments, the interlayer can have a thickness as measured in a direction orthogonal to the first major surface 142 of the substrate 140 of at least 50 nanometers and no greater than 10 micrometers. The interlayer can be disposed between the conductive sublayer and the first major surface 142 of the substrate 140 using any suitable technique, e.g., the same techniques described herein regarding the patterned conductive layer 146. In one or more embodiments, the interlayer and the conductive sublayer can be disposed on the first major surface 142 of the substrate 140 and then patterned using any suitable technique. Further, the second patterned conductive layer 168 can include any suitable number of layers. Although not shown, the second patterned conductive layer 168 can include one or more conductive sublayers and interlayers disposed between the conductive sublayers and the second major surface 144 of the substrate 140. Any suitable interlayer or interlayers can be utilized.

[0050] The patterned conductive layer 146 can include or define any suitable number of electrodes 148. As shown in FIGS. 4-5, the patterned conductive layer 146 includes a first electrode 148-1 and a second electrode 148-2 (collectively referred to herein as electrodes 148). Each of the electrodes 148 can each take any suitable shape and have any suitable dimensions. As shown in FIG. 6, which is a schematic top plan view of the assembly 130, each electrode 148 takes an elliptical shape in a plane parallel to the first major surface 142 of the substrate 140.Medtronic Ref. No. A0012883 WOO 1

[0051] Formed on at least one of the electrodes 148 is the patterned anodized layer 154. The patterned anodized layer 154 can be formed using any suitable technique. In one or more embodiments, the layer 154 can be formed using any suitable anodization technique. In one or more embodiments, the patterned anodized layer 154 can be formed using at least one of a sulfuric acid process (Type II anodization), a phosphoric acid process, a hard anodization process (Type III anodization), a plasma electrolytic oxidation process (PEO) or micro-arc oxidation process (MAO) (e.g., Keronite anodization), etc.

[0052] The patterned anodized layer 154 can be disposed on any suitable portion or portions of at least one of the patterned conductive layer 146 or the flange 162. Further, any suitable technique can be utilized to pattern the patterned anodized layer 154 as is further described herein regarding FIGS. 9A-F. For example, any suitable type of mask layer may be disposed on the patterned conductive layer 146 and / or the flange 162, and the unmasked portions of the patterned conductive layer and / or flange can be exposed to the anodization process to form the patterned anodized layer. Although not shown, a patterned anodized layer (e.g., similar to patterned anodized layer 154) can be formed on the second patterned conductive layer 168 utilizing the same techniques described herein regarding formation of the patterned anodized layer 154.

[0053] The anodized layer 154 can also have any suitable dimensions. For example, the anodized layer 154 can have a thickness measured in a direction orthogonal to the first major surface 142 of the substrate 140 of at least 1 micrometer and no greater than 100 micrometers.

[0054] As shown in FIGS. 6-7, the patterned anodized layer 154 can define one or more first nonconductive portions 156-1 and 156-2 of one or more of the electrodes 148 and one or more second nonconductive portions 158 of one or more of the electrodes. The first nonconductive portions 156 can be defined on the top surface 150 of one or more electrodes 148. The first nonconductive portions 156 can take any suitable shape and have any suitable dimensions. As shown in FIG. 6, the first nonconductive portions 156 of the first and second electrodes 148-1, 148-2 circumscribe conductive portions 160-1, 160-2 (collectively conductive portions 160) of the electrodes on their top surfaces 150-1, 150-2. The conductive portions 160 can be utilized to electrically connect at least one of a device, lead, or conductor to the electrodes 148. For example, as shown in FIG. 8, which is a schematic cross-section view of a hermetically-sealed package 200, conductor 292 is electrically connected to the second electrode 148-2 of the feedthrough assembly 130. In one or more embodiments, the conductive portion 160 of at least one of the electrodes 148 can be in direct contact with body tissue, fluids, or other media, so that the electrode can be configured to direct electrical signals to or receive electrical signals fromMedtronic Ref. No. A0012883 WOO 1 such tissue. Such conductive portions 160 can have a textured surface (e.g., micro- or nanotextured) to improve therapy delivery or sensing of electrical signals. Any suitable technique can be utilized to provide a textured surface to these conductive portions 160, e.g., laser texturing, etching, etc. Further, this textured surface can be provided by disposing any suitable conductive material such TiN, IrO2, Rh, or Pt on the conductive portions 160 using any suitable technique, e.g., deposition, chemical reaction, etc.

[0055] Returning to FIGS. 4-5, the one or more second nonconductive portions 158 can each take any suitable shape and have any suitable dimensions. In the illustrated embodiment, second nonconductive portions 158-1 and 158-2 of each of the first and second electrodes 148-1, 148-2 completely cover side surfaces 152-1, 152-2 of the first and second electrodes. In one or more embodiments, the second nonconductive portions 158 of the patterned anodized layer 154 can be disposed on only a region of the side surface 152 of at least one electrode 148 so that other portions of the side surfaces are exposed and provide conductive portions of the electrode. In one or more embodiments, at least a region 157 of the second nonconductive portion 158-1 of the first electrode 148-1 faces at least a region 159 of the second nonconductive portion 158-2 of the second electrode 148-2.

[0056] In general, portions of the patterned anodized layer 154 can be formed by consuming or converting portions of the electrode 148 using any suitable anodization technique. For example, a titanium patterned conductive layer 146 can be anodized using any suitable anodization technique to convert portions of the titanium to the patterned anodized layer 154. As shown in FIG. 7, the first nonconductive portion 156-1 of the anodized layer 154 can be formed on the top surface 150-1 of the first electrode 148-1 by converting or consuming portions 149 of the electrode during the anodization process that extend into the electrode. Although described regarding the first electrode 148-1, the same techniques can apply to the second electrode 148-2, any other portions of the patterned conductive layer 146, and the flange 162. The first nonconductive portion 156-1 of the anodized layer 154 defines the conductive portion 160-1 of the top surface 150-1 of the first electrode 148-1. As shown in FIG. 6, the region 157 of the second nonconductive portion 158-1 of the first electrode 148-1 faces the region 159 of the second nonconductive portion 158-2 of the second electrode 148-2. These nonconductive portions 156, 158 of the patterned anodized layer 154 can reduce arcing between portions of the patterned conductive layer 146 such as between first and second electrodes 148-1, 148-2, and between the flange 162 and the patterned conductive layer.Medtronic Ref. No. A0012883 WOO 1

[0057] The patterned anodized layer 154 can have any suitable characteristics. For example, the anodized layer 154 can have any suitable breakdown voltage, e.g., at least 1 V and no greater than 1500 V. Further, the anodized layer 154 can have any suitable dielectric strength.

[0058] Returning to FIGS. 4-5, the assembly 130 can further include one or more feedthroughs 134 disposed through the substrate 140 that can provide one or more electrical pathways between circuitry and electrical components disposed adjacent the first major surface 142 of the substrate and circuitry and components disposed adjacent the second major surface 144 of the substrate as is further described herein. For example, the assembly 130 includes a first feedthrough 134-1 disposed through the dielectric substrate 140 in a direction substantially orthogonal to the first major surface 142 of the dielectric substrate and electrically connected to the first electrode 148— 1, and a second feedthrough 134-2 (collectively feedthroughs 134) disposed through the dielectric substrate in the direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the second electrode 148-2. The assembly 130 can include any suitable number of feedthroughs 134, e.g., one, two, three, four, or more feedthroughs. In one or more embodiments, the assembly 130 can include one or more feedthroughs 134 (not shown) that can be electrically connected to the flange 162.

[0059] Each feedthrough 134 can be substantially identical in construction. In one or more embodiments, one or more feedthroughs 134 can have characteristics that are different from one or more additional feedthroughs. Each feedthrough 134 can include a via 136 (FIG. 5) disposed between the first major surface 142 and the second major surface 144 of the substrate 140. A conductive material 176 can be disposed in the via 136 to provide an electrical pathway between the first major surface 142 and the second major surface 144 of the substrate 140.

[0060] Each feedthrough 134 can be defined as including the associated electrode 148 of the patterned conductive layer 146. One or more electrodes 148 can be disposed over the via 136 adjacent the first major surface 142 of the substrate 140. In one or more embodiments, one or more electrodes 148 can be electrically connected to the conductive material 176 disposed in the via 136.

[0061] The via 136 of each feedthrough 134 can be any suitable dimensions and take any suitable shape. The size and shape of each via 136 is predicated on a thickness of the substrate 140 and the techniques utilized to provide the conductive material 176 that forms the electrical pathway between the first major surface 142 and the second major surface 144 of the substrate 140. Exemplary shapes for the via 136 can include parallel surface walls and / or tapered surface walls. In one or more embodiments where the substrate 140 has a thickness of approximately 100 to 500 micrometers, a typical opening for the via 136 at the first major surface 142 of theMedtronic Ref. No. A0012883 WOO 1 substrate 140 can be no greater than 500 micrometers, or no greater than 250 micrometers, or no greater than 100 micrometers, or no greater than 80 micrometers, or no greater than 50 micrometers, or no greater than 10 micrometers. Of course, the diameter of the via 136 could be larger (or smaller) than the illustrated examples based on the substrate thickness and / or the techniques utilized to provide the conductive material that forms the electrical pathway. Any suitable technique can be utilized to form each via 136, e.g., drilling, chemical etching, laser etching, etc.

[0062] The conductive material 176 of each via 136 can include any suitable conductive material or conductive materials, e.g., copper, titanium, aluminum, chromium, nickel, gold, platinum, composites (e.g., silver-filled epoxies), and combinations thereof. The conductive material 176 can be disposed in the via 136 using any suitable technique to provide a conductive pathway from the electrodes 148 to one or more devices (e.g., first electronic component 224-1 of FIG. 8) or contacts 170 disposed on or adjacent the second major surface 144 of the substrate 140. In one or more embodiments, the conductive material 176 can be disposed in the via 136 such that it substantially fills the via. In one or more embodiments, the conductive material 176 can be disposed in the via 136 along sidewalls of the via and the opening of the via at the first major surface 142.

[0063] One or more embodiments of feedthrough assemblies described herein can include one or more flanges connected to a substrate of the assembly. For example, as shown in FIGS. 4-5, the assembly 130 includes the flange 162 that is defined by one or more portions of the patterned conductive layer 146. In one or more embodiments, the assembly 130 can include one or more flanges formed separately from the patterned conductive layer 146 that can be connected to welding portions of the patterned conductive layer 146 using any suitable technique as described, e.g., in U.S. Patent No. 11,865,639, issued January 9, 2024, and entitled FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME.

[0064] The flange 162 can be configured to connect the substrate 140 to a housing of a package of device, e.g., a housing of an IMD. For example, as shown in FIG. 5, the flange 162 includes an edge 180 that is connected to a housing 112 of a device or package using any suitable technique, e.g., the same technique described herein regarding connection of the flange to the welding portion of the patterned conductive layer 146. The housing 112 includes a recess 188 disposed adjacent an edge 182 of the housing that is connected to the edge 180 of the flange of the assembly 130 so that the assembly is disposed at least partially within the recess of the housing. The recess 188 can take any suitable shape and have any suitable dimensions. In one or more embodiments, the flange 162 can be integral with the housing 112.Medtronic Ref. No. A0012883 WOO 1

[0065] An external coating or coatings can be disposed over at least a portion of the first major surface 142 of the dielectric substrate 140, the patterned conductive layer 146, and the patterned anodized layer 154 using any suitable technique. In one or more embodiments, such coating can be disposed over an entire outer surface 131 of the assembly 130. The external coating can include any suitable material, e.g., a biocompatible material. Suitable biocompatible coatings can include at least one of a ceramic or polymeric material. Further, suitable ceramic materials include at least one of aluminum oxide, glass, mica, titanium oxide, vanadium oxide, niobium oxide, zirconium oxide, hafnium oxide, silicon oxide, or silicon nitride. And suitable polymer materials include at least one of parylene, silicone, acrylic, polyurethane, or epoxy. In one or more embodiments, the coating can include a multilayer coating having any suitable material or materials, e.g., at least one of epoxy, parylene, polyimide, silicone, acrylic, urethane, or vinyl.

[0066] As mentioned herein, the feedthrough assembly 130 can be utilized with any suitable device or system to provide one or more electrical connections between electronic components or circuitry disposed within a housing of the device and electronic components or circuitry disposed external to the device. For example, FIG. 8 is a schematic cross-section view of a hermetically-sealed package 200 that includes a housing 212 and the feedthrough assembly 130 of FIGS. 4-7. The package 200 can be utilized with any suitable devices or systems, e.g., electronic systems used in smartphones, tablets, laptop computers, construction equipment, underwater equipment, implantable medical devices (IMDs), etc. Although depicted as including the feedthrough assembly 130 of FIGS. 4-7, the hermetically-sealed package 200 can include any suitable feedthrough assembly. In one or more embodiments, the feedthrough assembly 130 can form a part of the housing 212. The housing 212 and the feedthrough assembly 130 define an internal volume 228 within which one or more electronic components or circuitry 224 can be disposed.

[0067] The housing 212 of the package 200 can include any suitable dimensions and take any suitable shape. In general, the housing 212 is sized and shaped to at least partially surround the electronic devices 224. In one or more embodiments, the housing 212 can include one or more sidewalls 278 that can be connected to the feedthrough assembly 130 using any suitable technique, e.g., one or more of the techniques described in U.S. Patent No. 11,865,639, issued January 9, 2024, and entitled FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME. The housing 212 can completely surround and enclose the electronic devices 224, and the feedthrough assembly 130 can be connected to the housing. In one or more embodiments, the housing 212 can include an open side or face, and the feedthrough assembly 130 can be connected to the housing within this open side such that the feedthrough assembly forms a part ofMedtronic Ref. No. A0012883 WOO 1 the housing. The housing 212 can be a unitary housing or can include one or more sections that are joined together using any suitable technique.

[0068] The housing 212 can include any suitable material, e.g., at least one of an inorganic (e.g., metal, ceramic) or organic (e.g., polymeric) material. In one or more embodiments, the housing 212 can include at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, synthetic diamond, or gallium nitride (including clad structures, laminates etc.). In one or more embodiments, the housing 212 can include at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, nickel, Kovar, or AlMg (including clad structures, laminates etc.). In one or more embodiments, the housing 212 can include the same material as the dielectric substrate 140 of the feedthrough assembly 130.

[0069] The package 200 can include any suitable electronic components or circuitry 224 disposed on or at least partially within the housing 212. In one or more embodiments, the electronic components 224 can include any suitable integrated circuit or device, e.g., a controller, a multiplexer, etc. It should be understood that any of the electronic devices mentioned in this disclosure can be coupled to a power source. In the embodiment illustrated in FIG. 8, the electronic components 224 include the first electronic component 224-1 and the second electronic component 224-2 (collectively electronic components 224). The first electronic component 224-1 can be electrically connected to the internal contacts 170 of the second patterned conductive layer 168 using any suitable technique.

[0070] Further, the package 200 can include the second electronic component 224-2 disposed in any suitable location within the housing 212. The second electronic component 224-2 can include any suitable component or circuitry. In one or more embodiments, the second electronic component 224-2 can include a power source that is adapted to provide power to one or more integrated circuits or devices disposed within the housing 212 or exterior to the housing. Any suitable power source can be disposed within the housing 212, e.g., one or more batteries, capacitors, etc. The power source can be rechargeable by electrically connecting the power source to a power supply through the feedthrough assembly 130. In one or more embodiments, the power source can be adapted to be inductively charged by an inductive power system that is external to the package 200. The power source can be electrically connected to the first electronic component 224-1 using any suitable technique. In one or more embodiments, the power source can include a hermetically-sealed battery that is connected to the feedthrough assembly 130 using any suitable technique or techniques.

[0071] The housing 212 can be connected to the feedthrough assembly 130 using any suitable technique. In the embodiment illustrated in FIG. 8, the edge 180 of the flange 162 is connected toMedtronic Ref. No. A0012883 WOO 1 an edge 282 of the housing 212 using any suitable technique, e.g., by a bond or weld 284. Any suitable technique can be utilized to form the weld 284, e.g., the same techniques described herein regarding the weld 165 between the flange 162 and the substrate 140.

[0072] The housing 212 of the package 200 can include a ledge or tab 286 that extends from an inner surface 290 of the housing. The ledge 286 can be configured to support the second major surface 144 of the feedthrough assembly 130. The ledge 286 can take any suitable shape and have any suitable dimensions.

[0073] Any suitable technique can be utilized to form the various embodiments of feedthrough assemblies and hermetically-sealed packages described herein. For example, FIGS. 9A-F are schematic cross-section views of one technique 300 of forming the feedthrough assembly 130. Although described regarding feedthrough assembly 130 of FIGS. 4-7 and the hermetically-sealed package 200 of FIG. 8, the technique 300 can be utilized to form any suitable feedthrough assembly and package. In FIG. 9A, a conductive layer 304 can be disposed on a first major surface 342 of a substrate wafer 302 using any suitable technique. The dielectric substrate wafer 302 further includes a second major surface 344 and defines a dielectric substrate (e.g., dielectric substrate 140) of each of one or more feedthrough assemblies (e.g., feedthrough assembly 130) that can be manufactured utilizing the technique 300.

[0074] As shown in FIG. 9B, the conductive layer 304 can be selectively bonded or connected to the first major surface 342 of the substrate wafer 302 using any suitable technique to form one or more bonds 366 using any suitable technique, e.g., laser-assisted diffusion bonding. One or more feedthroughs 134 can also be formed through the substrate wafer 302 using any suitable technique.

[0075] The conductive layer 304 can be patterned as shown in FIG. 9C using any suitable technique to form a patterned conductive layer 306 on the first major surface 342 of the dielectric substrate wafer 302. For example, an etch mask (not shown) can be disposed on the conductive layer 304, the conductive layer can be patterned through the etch mask to form the patterned conductive layer, and the etch mask can be removed from the patterned conductive layer. The patterned conductive layer 306 can include one or more electrodes 350.

[0076] Portions of the patterned conductive layer 306 can be anodized utilizing any suitable anodization mask 392 as shown in FIG. 9D using any suitable technique to form a patterned anodized layer 308. For example, prior to patterning the conductive layer 304, a gold anodization mask can be disposed on the patterned conductive layer 306 and patterned using any suitable technique. A titanium blanket or separator layer can be disposed on the patterned anodization mask and the patterned conductive layer 306 using any suitable technique. Further, a gold etchMedtronic Ref. No. A0012883 WOO 1 mask can be deposited over the separator layer and patterned using any suitable technique. The conductive layer 304 can be patterned through the etch mask, the separator layer, and the anodization mask using any suitable technique to provide the patterned conductive layer 306. The etch mask can then be removed, and the separator layer can be patterned using any suitable technique. The patterned conductive layer 306 can be anodized through the anodization mask 392 to form the patterned anodized layer 308, and the anodization mask can be removed using any suitable technique as shown in FIG. 9E. Prior to anodization, one or more flanges (e.g., flanges 162) can be defined by the patterned conductive layer 306 using any suitable technique, and portions of the flanges can be anodized while anodizing the patterned conductive layer or in a separate anodization process.

[0077] Further, the patterned conductive layer 306, flanges, and substrate wafer 302 can be singulated using any suitable technique as shown in FIG. 9E to form two or more feedthrough assemblies 130 as shown in FIG. 9F.

[0078] This disclosure includes without limitation the following Clauses:

[0079] Clause 1. A feedthrough assembly comprising: a dielectric substrate comprising a first major surface and a second major surface; a patterned conductive layer disposed on the first major surface of the dielectric substrate and comprising an electrode that comprises a top surface and a side surface; and a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

[0080] Clause 2. The assembly of Clause 1, wherein the first nonconductive portion of the anodized layer circumscribes the conductive portion of the top surface of the electrode.

[0081] Clause 3. The assembly of any one of Clauses 1-2, wherein the second nonconductive portion of the electrode completely covers the side surface of the electrode.

[0082] Clause 4. The assembly of any one of Clauses 1-3, wherein the anodized layer comprises a breakdown voltage of at least 1 V.

[0083] Clause 5. The assembly of any one of Clauses 1-4, wherein the anodized layer comprises a thickness of at least 1 micrometer and no greater than 150 micrometers.

[0084] Clause 6. The assembly of any one of Clauses 1-5, further comprising a dielectric coating disposed over at least a portion of the first major surface of the dielectric substrate, the patterned conductive layer, and the patterned anodized layer.

[0085] Clause 7. The assembly of any one of Clauses 1-6, wherein the electrode defines a first electrode, wherein the patterned conductive layer further comprises a second electrodeMedtronic Ref. No. A0012883 WOO 1 comprising a top surface and a side surface, wherein the patterned anodized layer is formed on the second electrode and defines a first nonconductive portion of the second electrode on the top surface of the second electrode, a second nonconductive portion of the second electrode on the side surface of the second electrode, and a conductive portion of the second electrode on the top surface of the second electrode, wherein at least a region of the second nonconductive portion of the first electrode faces at least a region of the second nonconductive portion of the second electrode.

[0086] Clause 8. The assembly of Clause 7, further comprising: a first feedthrough disposed through the dielectric substrate in a direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the first electrode; and a second feedthrough disposed through the dielectric substrate in the direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the second electrode.

[0087] Clause 9. The assembly of any one of Clauses 1-8, wherein the patterned conductive layer is laser bonded to the dielectric substrate.

[0088] Clause 10. The assembly of any one of Clauses 1-9, wherein the patterned conductive layer is laser-assisted diffusion bonded to the dielectric substrate.

[0089] Clause 11. The assembly of any one of Clauses 1-10, wherein the patterned conductive layer defines a flange configured to connect the assembly to a housing of a hermetically-sealed package.

[0090] Clause 12. The assembly of any one of Clauses 1-11, wherein the dielectric substrate comprises at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, or gallium nitride.

[0091] Clause 13. The assembly of any one of Clauses 1-12, wherein the patterned conductive layer comprises at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, or iridium.

[0092] Clause 14. A hermetically-sealed package comprising a housing and a feedthrough assembly that forms a part of the housing and is hermetically sealed to the housing, wherein the feedthrough assembly comprises: a dielectric substrate comprising a first major surface and a second major surface; a patterned conductive layer disposed on the first major surface of the dielectric substrate and comprising an electrode that comprises a top surface and a side surface; and a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.Medtronic Ref. No. A0012883 WOO 1

[0093] Clause 15. The package of Clause 14, wherein the patterned conductive layer defines a flange configured to connect the assembly to a housing of a hermetically-sealed package.

[0094] Clause 16. The package of Clause 15, wherein the housing further comprises a recess disposed adjacent an edge of the housing that is connected to an edge of the flange of the feedthrough assembly, wherein the feedthrough assembly is disposed at least partially within the recess of the housing.

[0095] Clause 17. The package of any one of Clauses 15-16, wherein the patterned anodized layer further defines a nonconductive portion of the flange.

[0096] Clause 18. The package of any one of Clauses 14-17, wherein the housing further comprises a ledge extending from an inner surface of the housing, wherein the ledge is configured to support the second major surface of the feedthrough assembly.

[0097] Clause 19. The package of any one of Clauses 14-18, wherein the first nonconductive portion of the electrode of the feedthrough assembly circumscribes the conductive portion on the top surface of the electrode.

[0098] Clause 20. The package of any one of Clauses 14-19, wherein the second nonconductive portion of the electrode of the feedthrough assembly completely covers the side surface of the electrode.

[0099] Clause 21. The package of any one of Clauses 14-20, wherein the anodized layer of the feedthrough assembly comprises a breakdown voltage of at least 1 V.

[0100] Clause 22. The package of any one of Clauses 14-21, wherein the anodized layer of the feedthrough assembly comprises a thickness of at least 1 micrometer and no greater than 150 micrometers.

[0101] Clause 23. The package of any one of Clauses 14-22, further comprising a dielectric coating disposed over at least a portion of the first major surface of the dielectric substrate, the patterned conductive layer, and the patterned anodized layer.

[0102] Clause 24. The package of any one of Clauses 14-23, wherein the electrode of the feedthrough assembly defines a first electrode, wherein the patterned conductive layer of the feedthrough assembly further comprises a second electrode comprising a top surface and a side surface, wherein the patterned anodized layer is formed on the second electrode and defines a first nonconductive portion of the second electrode on the top surface of the second electrode, a second nonconductive portion of the second electrode on the side surface of the second electrode, and a conductive portion of the second electrode on the top surface of the second electrode, wherein at least a region of the second nonconductive portion of the first electrode faces at least a region of the second nonconductive portion of the second electrode.Medtronic Ref. No. A0012883 WOO 1

[0103] Clause 25. The package of Clause 24, wherein the feedthrough assembly further comprises: a first feedthrough disposed through the dielectric substrate in a direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the electrode; and a second feedthrough disposed through the dielectric substrate in the direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the second electrode.

[0104] Clause 26. The package of any one of Clauses 14-25, wherein the patterned conductive layer of the feedthrough assembly is laser bonded to the dielectric substrate.

[0105] Clause 27. The package of Clause 26, wherein the patterned conductive layer of the feedthrough assembly is laser-assisted diffusion bonded to the dielectric substrate.

[0106] Clause 28. The package of any one of Clauses 14-27, wherein the patterned conductive layer of the feedthrough assembly defines a first patterned conductive layer, wherein the package further comprises a second patterned conductive layer disposed on the second major surface of the dielectric substrate.

[0107] Clause 29. The package of any one of Clauses 14-28, wherein the dielectric substrate of the feedthrough assembly comprises at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, or gallium nitride.

[0108] Clause 30. The package of any one of Clauses 14-29, wherein the patterned conductive layer of the feedthrough assembly comprises at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, or iridium.

[0109] Clause 31. An implantable medical device comprising the hermetically-sealed package of any one of Clauses 14-30.

[0110] Clause 32. A wafer comprising: a wafer substrate; and a plurality of feedthrough assemblies disposed on the wafer substrate, wherein each feedthrough assembly comprises: a dielectric substrate formed from the wafer substrate and comprising a first major surface and a second major surface; a patterned conductive layer disposed on the first major surface of the dielectric substrate and comprising an electrode that comprises a top surface and a side surface; and a patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.[OHl] Clause 33. The wafer of Clause 32, wherein the first nonconductive portion of the electrode of at least one feedthrough assembly circumscribes the conductive portion of the electrode on the top surface of the electrode.Medtronic Ref. No. A0012883 WOO 1

[0112] Clause 34. The wafer of any one of Clauses 32-33, wherein the second nonconductive portion of the electrode of at least one feedthrough assembly completely covers the side surface of the electrode.

[0113] Clause 35. The wafer of any one of Clauses 32-34, wherein the anodized layer comprises a breakdown voltage of at least 1 V.

[0114] Clause 36. The wafer of any one of Clauses 32-35, wherein the anodized layer comprises a thickness of at least 1 micrometer and no greater than 150 micrometers.

[0115] Clause 37. The wafer of any one of Clauses 32-36, further comprising a dielectric coating disposed over at least a portion of the first major surface of the dielectric substrate, the patterned conductive layer, and the patterned anodized layer.

[0116] Clause 38. The wafer of any one of Clauses 32-37, wherein the electrode of at least one feedthrough assembly defines a first electrode, wherein the patterned conductive layer of the at least one feedthrough assembly further comprises a second electrode comprising a top surface and a side surface, wherein the patterned anodized layer is formed on the second electrode and defines a first nonconductive portion of the second electrode on the top surface of the second electrode, a second nonconductive portion of the second electrode on the side surface of the second electrode, and a conductive portion of the second electrode on the top surface of the second electrode, wherein at least a region of the second nonconductive portion of the first electrode faces at least a region of the second nonconductive portion of the second electrode.

[0117] Clause 39. The wafer of Clause 38, wherein at least one feedthrough assembly further comprises: a first feedthrough disposed through the dielectric substrate in a direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the electrode; and a second feedthrough disposed through the dielectric substrate in the direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the second electrode.

[0118] Clause 40. The wafer of any one of Clauses 32-39, wherein the patterned conductive layer of at least one feedthrough assembly is laser bonded to the dielectric substrate.

[0119] Clause 41. The wafer of Clause 40 wherein the patterned conductive layer is laser-assisted diffusion bonded to the dielectric substrate.

[0120] Clause 42. The wafer of any one of Clauses 32-41, wherein the patterned conductive layer of at least one feedthrough assembly defines a flange configured to connect the assembly to a housing of a hermetically-sealed package.

[0121] Clause 43. The wafer of any one of Clauses 32-42, wherein the wafer substrate comprises at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, or gallium nitride.Medtronic Ref. No. A0012883 WOO 1

[0122] Clause 44. The wafer of any one of Clauses 32-43, wherein the patterned conductive layer of each feedthrough assembly comprises at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, or iridium.

[0123] Clause 45. A method comprising: disposing a conductive layer on a first major surface of a dielectric substrate wafer, wherein the dielectric substrate wafer comprises the first major surface and a second major surface; selectively bonding the conductive layer to the first major surface of the dielectric substrate wafer; patterning the conductive layer to form a patterned conductive layer on the first major surface of the dielectric substrate wafer, wherein the patterned conductive layer comprises an electrode; and anodizing portions of the patterned conductive layer to form a patterned anodized layer that defines a first nonconductive portion of the electrode on a top surface of the electrode, a second nonconductive portion of the electrode on a side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

[0124] Clause 46. The method of Clause 45, wherein patterning the conductive layer comprises: disposing an etch mask on the conductive layer; etching the conductive layer through the etch mask to form the patterned conductive layer; and removing the etch mask from the patterned conductive layer.

[0125] Clause 47. The method of any one of Clauses 45-46, wherein anodizing portions of the patterned conductive layer comprises: disposing an anodization mask on the patterned conductive layer; anodizing the patterned conductive layer through the anodization mask to form the patterned anodized layer; and removing the anodization mask from the patterned anodized layer.

[0126] Clause 48. The method of any one of Clauses 45-47, wherein selectively bonding the conductive layer comprises selectively laser bonding the conductive layer to the first major surface of the dielectric substrate.

[0127] Clause 49. The method of any one of Clauses 45-48, wherein the electrode defines a first electrode, wherein patterning the conductive layer further comprises patterning the conductive layer to form a second electrode on the first major surface of the dielectric substrate wafer, wherein the second electrode comprises a top surface and a side surface, wherein the second electrode is adjacent the first electrode.

[0128] Clause 50. The method of Clause 49, wherein the patterned anodized layer further defines a first nonconductive portion of the second electrode on a top surface of the second electrode, a second nonconductive portion of the second electrode on a side surface of the second electrode, and a conductive portion of the second electrode on the top surface of the second electrode,Medtronic Ref. No. A0012883 WOO 1 wherein at least a region of the second nonconductive portion of the first electrode faces at least a region of the second nonconductive portion of the second electrode.

[0129] Clause 51. The method of Clause 50, further comprising: disposing a first feedthrough through the dielectric substrate wafer between the first major surface and the second major surface of the dielectric substrate wafer in a direction substantially orthogonal to the first major surface, wherein the feedthrough is electrically connected to the first electrode; and disposing a second feedthrough through the dielectric substrate wafer between the first major surface and the second major surface of the dielectric substrate wafer in a direction substantially orthogonal to the first major surface, wherein the second feedthrough is electrically connected to the second electrode.

[0130] Clause 52. The method of any one of Clauses 45-51, further comprising singulating the dielectric substrate wafer, the patterned conductive layer, and the patterned anodized layer to form two or more feedthrough assemblies.

[0131] Clause 53. The feedthrough assembly of any one of Clauses 1-13, wherein the conductive portion of the electrode on the top surface of the electrode comprises a textured surface.

[0132] Clause 54. The package of any one of Clauses 14-31, wherein the conductive portion of the electrode on the top surface of the electrode comprises a textured surface.

[0133] Clause 55. The wafer of any one of Clauses 32-44, wherein the conductive portion of the electrode on the top surface of the electrode comprises a textured surface.

[0134] Clause 56. The method of any one of Clauses 45-52, further comprising texturing the conductive portion of the electrode that is on the top surface of the electrode.

[0135] It should be understood that various aspects disclosed herein may be combined in different combinations than the combinations specifically presented in the description and accompanying drawings. It should also be understood that, depending on the example, certain acts or events of any of the processes or methods described herein may be performed in a different sequence, may be added, merged, or left out altogether (e.g., all described acts or events may not be necessary to carry out the techniques). In addition, while certain aspects of this disclosure are described as being performed by a single module or unit for purposes of clarity, it should be understood that the techniques of this disclosure may be performed by a combination of units or modules associated with, for example, a medical device.

[0136] All references and publications cited herein are expressly incorporated herein by reference in their entirety into this disclosure, except to the extent they may directly contradict this disclosure. Illustrative embodiments of this disclosure are discussed, and reference has been made to possible variations within the scope of this disclosure. These and other variations andMedtronic Ref. No. A0012883 WOO 1 modifications in the disclosure will be apparent to those skilled in the art without departing from the scope of the disclosure, and it should be understood that this disclosure is not limited to the illustrative embodiments set forth herein. Accordingly, the disclosure is to be limited only by the claims provided below.

Claims

Medtronic Ref. No. A0012883 WOO 1 WHAT IS CLAIMED IS:

1. A feedthrough assembly comprising:a dielectric substrate comprising a first major surface and a second major surface;a patterned conductive layer disposed on the first major surface of the dielectric substrate and comprising an electrode that comprises a top surface and a side surface; anda patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

2. The assembly of claim 1, wherein the anodized layer comprises a breakdown voltage of at least 1 V.

3. The assembly of any one of claims 1-2, wherein the anodized layer comprises a thickness of at least 1 micrometer and no greater than 150 micrometers.

4. The assembly of any one of claims 1-3, further comprising a dielectric coating disposed over at least a portion of the first major surface of the dielectric substrate, the patterned conductive layer, and the patterned anodized layer.

5. The assembly of any one of claims 1-4, wherein the electrode defines a first electrode, wherein the patterned conductive layer further comprises a second electrode comprising a top surface and a side surface, wherein the patterned anodized layer is formed on the second electrode and defines a first nonconductive portion of the second electrode on the top surface of the second electrode, a second nonconductive portion of the second electrode on the side surface of the second electrode, and a conductive portion of the second electrode on the top surface of the second electrode, wherein at least a region of the second nonconductive portion of the first electrode faces at least a region of the second nonconductive portion of the second electrode.

6. The assembly of claim 5, further comprising:a first feedthrough disposed through the dielectric substrate in a direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the first electrode; andMedtronic Ref. No. A0012883 WOO 1 a second feedthrough disposed through the dielectric substrate in the direction substantially orthogonal to the first major surface of the dielectric substrate and electrically connected to the second electrode.

7. The assembly of any one of claims 1-6, wherein the patterned conductive layer defines a flange configured to connect the assembly to a housing of a hermetically-sealed package.

8. A hermetically-sealed package comprising a housing and a feedthrough assembly that forms a part of the housing and is hermetically sealed to the housing, wherein the feedthrough assembly comprises:a dielectric substrate comprising a first major surface and a second major surface;a patterned conductive layer disposed on the first major surface of the dielectric substrate and comprising an electrode that comprises a top surface and a side surface; anda patterned anodized layer formed on the electrode that defines a first nonconductive portion of the electrode on the top surface of the electrode, a second nonconductive portion of the electrode on the side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

9. The package of claim 8, wherein the patterned conductive layer defines a flange configured to connect the assembly to a housing of a hermetically-sealed package.

10. The package of claim 9, wherein the housing further comprises a recess disposed adjacent an edge of the housing that is connected to an edge of the flange of the feedthrough assembly, wherein the feedthrough assembly is disposed at least partially within the recess of the housing.

11. The package of any one of claims 9-10, wherein the patterned anodized layer further defines a nonconductive portion of the flange.

12. The package of any one of claims 8-11, wherein the housing further comprises a ledge extending from an inner surface of the housing, wherein the ledge is configured to support the second major surface of the feedthrough assembly.

13. The package of any one of claims 8-12, wherein the anodized layer of the feedthrough assembly comprises a thickness of at least 1 micrometer and no greater than 150 micrometers.Medtronic Ref. No. A0012883 WOO 114. An implantable medical device comprising the hermetically-sealed package of any one of claims 8-13.

15. A method compri sing :disposing a conductive layer on a first major surface of a dielectric substrate wafer, wherein the dielectric substrate wafer comprises the first major surface and a second major surface;selectively bonding the conductive layer to the first major surface of the dielectric substrate wafer;patterning the conductive layer to form a patterned conductive layer on the first major surface of the dielectric substrate wafer, wherein the patterned conductive layer comprises an electrode; andanodizing portions of the patterned conductive layer to form a patterned anodized layer that defines a first nonconductive portion of the electrode on a top surface of the electrode, a second nonconductive portion of the electrode on a side surface of the electrode, and a conductive portion of the electrode on the top surface of the electrode.

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