Conductive contacts for electrical components

Abstract

Provided herein are signal contacts facilitating transmission of high-frequency signals with superior signal integrity through the formation of a plurality of signal paths through the signal contacts. A signal contact according to one aspect of the technology disclosed herein forms, when compressed, three points of contact between spring contact arms and an intermediate portion of the spring contact. A further signal contact according to another aspect of the technology disclosed herein includes a tongue portion configured to be contacted by spring contact arms of the signal contact when the signal contact is compressed.

Description

Attorney Docket No. A1245.70012 WO00-1- CONDUCTIVE CONTACTS FOR ELECTRICAL COMPONENTSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 63 / 860,602, filed August 8, 2025 and titled “CONDUCTIVE CONTACTS FOR ELECTRICAL COMPONENTS,” and of U.S. Provisional Patent Application No. 63 / 791,306, filed April 18, 2025 and titled “CONDUCTIVE CONTACTS FOR ELECTRICAL COMPONENTS.” The foregoing applications are hereby incorporated herein by reference in their entirety.BACKGROUNDField

[0002] Aspects of the present technology relate to conductive contacts for electrical components.Related Art

[0003] Conductive contacts are part of various electrical components, including electrical connectors. The conductive contacts provide a signal path for electrical signals sent by or received by the electrical components. In some connectors, multiple conductive contacts are arranged in an array and are in close proximity to each other.BRIEF SUMMARY

[0004] Embodiments of signal contacts providing a plurality of signal paths are described herein.

[0005] In accordance with some embodiments, a contact for a signal connector may include an intermediate portion and a first compliant arm extending from the intermediate portion in a first direction. The first compliant arm may include a first contact tip and be configured to bend in response to compression of the contact in the first direction so that the first contact tip contacts the intermediate portion.

[0006] In accordance with some embodiments, a contact for a signal connector may include an intermediate portion, a first compliant arm extending from the intermediate portion in a first direction, and a projection extending from the intermediate portion in second direction perpendicular to the first direction. A first contact region of the first compliant arm may be#15157389v2configured to contact the projection upon compression of the contact in the first direction. The contact may have a substantially constant thickness.BRIEF DESCRIPTION OF DRAWINGS

[0007] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing.

[0008] FIG. 1 A illustrates a perspective view of a conductive contact in an uncompressed state, according to an embodiment of the present technology.

[0009] FIG. IB illustrates a perspective view of the conductive contact of FIG. 1 A in a compressed state, according to an embodiment of the present technology.

[0010] FIG. 2A illustrates a perspective view of an alternative conductive contact in an uncompressed state, according to an embodiment of the present technology.

[0011] FIG. 2B illustrates a perspective view of the conductive contact of FIG. 1 A in a compressed state, according to an embodiment of the present technology.

[0012] FIG. 3 illustrates an interposer having a plurality of electrical contacts of the types described herein, according to an embodiment of the present technology.

[0013] FIG. 4 illustrates a perspective view of an electronic assembly including the interposer of FIG. 3, according to an embodiment of the present technology.DETAILED DESCRIPTION

[0014] The inventors have developed conductive contacts which are beneficial in electrical signal connectors. The conductive contacts may provide various benefits. As an example, they may facilitate transmission of high-frequency signals, for instance by providing for high signal integrity. They may have a construction and form factor facilitating their use in high density arrays of contacts. They may provide benefits in the context of differential signaling as well.

[0015] Signal integrity is a measure of the quality of an electrical signal. Signal integrity may be impacted by transmission line effects such as losses and reflections, coupling effects such as crosstalk, ground currents, and electromagnetic interference, for example. These phenomena may arise from factors relating to the conductors transmitting the electrical signal as well as their environment. For example, signal integrity may be impacted by the materials and geometry of transmitting conductors as well as the proximity of distinct or related electrical signals.#15157389v2

[0016] In many cases, the impact of such factors on signal integrity may be frequencydependent. For example, a low frequency signal may exhibit different signal integrity when transmitted down a conductor of a certain geometry than a high frequency signal transmitted down the same conductor. Accordingly, conductive contacts suitable for low-frequency applications may be unsuitable for high-frequency applications.

[0017] Provided herein are aspects and embodiments of conductive contacts suitable for transmission of high-frequency signals with superior signal integrity. Moreover, the signal contacts may provide superior performance in the context of differential signaling, for example by providing beneficial common mode behavior.

[0018] High-frequency signals as described herein include signals having a frequency greater than 500 MHz, greater than 1 GHz, greater than 10 GHz, greater than 25 GHz, greater than 50 GHz, and / or greater than 100 GHz.

[0019] Conductive contacts as described herein are suitable — by way of example and not limitation — for single-ended signal transmission, differential signal transmission, as well as for use as ground contacts.

[0020] Conductive contacts as described herein may be integrated into any suitable electrical system, including — by way of example and not limitation — systems having interposers, printed circuit boards, semiconductor chips, compliant interfaces, and so forth.

[0021] Conductive contacts as described herein may be suitable for use in an array of conductive contacts. The array may include conductive contacts of various construction. The array may be regular or irregular in shape, and the conductive contacts may be offset with respect to a row direction and / or a column direction. The array may have a row spacing and / or a column spacing of less than 2 millimeters (mm), less than 1 mm, and / or less than 0.5 mm. In some embodiments, adjacent conductive contacts forming a differential pair of contacts may be oriented “front-to-fronf ’ or “back-to-back” such that the conductive contacts of the differential pair are 180 degrees offset with respect to one another, as described further below.

[0022] Conductive contacts as described herein may include any suitable material. For example, conductive contacts of the types described herein may include copper or gold. As a specific example, the contacts may be formed of a copper alloy with a gold plating over some or all of the contact.

[0023] Conductive contacts as described herein may be formed by any suitable process. For example, conductive contacts may be stamped, and additionally or alternatively formed, from a piece of conductive material such as a strip of conductive material.#15157389v2

[0024] Conductive contacts as described herein may exhibit various mechanical and electrical features of interest for desired performance of an electrical connector in which the conductive contacts are integrated. In some circumstances, the conductive contacts described herein may exhibit tradeoffs between mechanical performance and electrical performance.

[0025] Examples of mechanical features of interest include robustness, reliability of connection with a mating pad, and controlled deformation within constraints of a slot in which a conductive contact is disposed. Examples of electrical features of interest include mode conversion, impedance, tank resonance, and crosstalk.

[0026] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may be suitably robust for an intended application. Conductive contacts may undergo a large number (e.g., tens or hundreds) of matings over a lifetime of an electrical connector in which the conductive contacts are integrated. Each time the contact is mated, it may be compressed, causing strain. Accordingly, the conductive contacts, the interposers, and / or the connectors may be configured to repeatably compress and uncompress without degradation and / or worsening of mechanical performance, thus providing for long life of the contacts.

[0027] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may exhibit reliable mechanical, and therefore electrical, contact with a conductive pad.

[0028] For example, a conductive contact may include a mating contact portion which is configured to contact a pad. The pad may exert a force on the mating contact portion which causes the conductive contact to compress. Compression of the conductive contact may alter its shape and / or impact its positioning, which may cause the mating contact portion to move relative to the pad. In some circumstances, movement of the mating contact portion relative to the pad may cause the mating contact portion to “slide” off the pad such that mechanical and / or electrical connection is lost. Accordingly, the conductive contacts, the interposers, and / or the connectors may advantageously be configured such that the conductive contacts do not lose mechanical and / or electrical connection with mating pads when compressed. As one example, the conductive contacts may be shaped and / or oriented such that a mating contact portion of the contact reliably connects to a pad even when compressed as part of establishing a connection.

[0029] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may be adapted to dimensional constraints of a slot in which the conductive contacts are configured to be disposed. For example, a conductive contact may be disposed in a slot of an interposer. The slot may have#15157389v2dimensions which constrain the conductive contact when the conductive contact is compressed and / or uncompressed. As one example, compressing the conductive contact may cause portions of the conductive contact to press against walls of the slot. The walls of the slot may therefore guide and / or constrain deformation of the conductive contact during compression. However, this guiding and / or constraining may, if not accounted for in the structure of the conductive contact, cause undesirable deformation of the conductive contact and reduce mechanical and / or electrical performance such as formation of undesired points of contact or the prevention of physical connection at the desired points of the electrical contact.

[0030] Accordingly, the conductive contacts, the interposers, and / or the connectors may advantageously be configured such that compression of the conductive contacts within dimensional constraints of a slot results in desired deformation of the conductive contacts. As one example, the conductive contacts may provide for a point of contact between spring contact arms which serves to control deformation of the conductive contacts within slots. As another example, the conductive contacts may provide for a tongue portion which serves to control deformation of the conductive contacts within slots.

[0031] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may mitigate mode conversion in the context of a differential pair. A pair of conductive contacts configured to transmit differential signals may constitute a differential pair. Mode conversion — for example, conversion of a differential signal to a common mode signal or conversion of a common mode signal to differential signal — may worsen the signal integrity of the differential pair. Mode conversion may be more pronounced when a first conductive contact of the differential pair has a different relative positioning to ground (e.g. a grounded conductive shielding at least partially surrounding the differential pair) than a second conductive contact of the differential pair.Accordingly, the conductive contacts, the interposers, and / or the connectors may advantageously be configured such that the differential pair is symmetrically oriented with respect to ground. For example, a differential pair of signal contacts may be oriented at 180 degrees relative to each other, for example in a “back-to-back” configuration or alternatively in a “front-to-front” configuration, such that the differential pair is symmetrically bounded by grounded walls of a grounded shield. In some embodiments, a differential pair may be “back-to-back” when an intermediate base portion of a first contact of the differential pair is arranged proximate to an intermediate base portion of a second contact of the differential pair. In some embodiments, a differential pair may be “front-to-front” when the intermediate base portion of the first contact is arranged distal to the intermediate base portion of the second contact.#15157389v2

[0032] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may provide desirable impedance characteristics (e.g. mitigating impedance mismatch and / or mitigating impedance spikes). Impedance of the conductive contacts may be based at least in part on geometry (e.g. width, thickness) and material (e.g. material of an interposer having a dielectric constant) of the conductive contacts and / or the connectors in which they are integrated. Matching impedance of the conductive contacts to impedance of pads or other circuit components which the conductive contacts are configured to connect to may provide desirable signal integrity of signals transmitted through the conductive contacts. Geometry of mating contact portions may advantageously provide for this impedance match. However, because in some circumstances the conductive contacts may not be completely compressed even when the conductive contacts are mated to respective pads, portions of the conductive contacts may protrude beyond an interposer in which they are disposed. Protruding portions of the conductive contacts may cause a spike in impedance of the conductive contacts. Accordingly, the conductive contacts, the interposers, and / or the connectors may advantageously provide desirable impedance, for example by mitigating the spike in impedance otherwise resulting from the protruding portions.

[0033] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may mitigate the formation of a “tank resonance” within an operating frequency range of a connector in which the conductive contacts are integrated. Tank resonance includes resonance associated with an inductance and a capacitance of a transmission path such as a conductive contact having a first point of contact between a first spring contact arm and an intermediate portion and a second point of contact between a second spring contact arm and the intermediate portion. Tank resonance may be exhibited at frequencies which depend on geometry of the conductive contact. The tank resonance may result in signals undesirably looping within a portion of the contact rather than transmitting through the contact, representing degradation of the signal transmission.

[0034] Accordingly, the conductive contacts, the interposers, and / or the connectors may advantageously mitigate tank resonance, for example by providing for a geometry such that tank resonant frequencies are outside of the operating range of an electrical connector in which the conductive contacts are integrated. As one example, providing a third point of contact within a conductive contact, for example between a first spring arm and a second spring arm of the electrical contact, may substantially raise a tank resonance frequency of the conductive contact outside the target operating range. As another example, the conductive contacts may provide for a tongue portion which, by nature of a location of points of contact established therewith, may#15157389v2substantially raise a tank resonance frequency of the conductive contact outside the target operating range.

[0035] In some embodiments, conductive contacts as described herein, as well as interposers and / or connectors in which they may be integrated, may mitigate crosstalk between signal contacts of the conductive contacts. For example, an interposer may include inserts each having a differential pair of conductive contacts. Crosstalk may occur between differential pairs of distinct inserts, for example due to portions of the conductive contacts which may protrude beyond a grounded shielding of the interposer. This crosstalk may worsen signal integrity of signals transmitted on the conductive contacts. Accordingly, the conductive contacts, the interposers, and / or the connectors may advantageously mitigate crosstalk between signal contacts, for example by mitigating the presence and / or effect of protruding portions of the conductive contacts.

[0036] Multiple embodiments of conductive contacts according to aspects of the technology disclosed herein will be described in conjunction with FIGs. 1 A-2B. Conductive contacts as disclosed herein may be configured as spring contacts with a first compressible end configured for electrically coupling to a first conductive element and a second compressible end configured for electrically coupling to a second conductive element.

[0037] FIG. 1A illustrates a perspective view of a conductive contact 100 in an uncompressed state. FIG. IB illustrates a perspective view of the conductive contact 100 in a compressed state, according to an embodiment of the present technology.

[0038] As shown, conductive contact 100 includes an intermediate portion 110 and spring contact arms 120 extending from opposite ends of intermediate portion 110. Each spring contact arm 120 has a mating contact portion 122 and terminates at a spring portion 124.

[0039] Mating may cause conductive contact 100 to compress. For example, a first mating electrical component may mate with and exert pressure on first mating contact portion 122a and a second mating electrical component may mate with and exert pressure on second mating contact portion 122b. The exerted pressure may cause the mating contact portions 122a and 122b to move toward one another, for example by bending. As a result, contact arms 120a and 120b may also move toward one another.

[0040] As shown, in some embodiments the contact arms 120 may have a loop-like shape. Because of the loop-like shape of the contact arms 120, the exerted pressure during compression of conductive contact 100 may cause spring portions 124a and 124b to travel away from one another as contact arms 120a and 120b curl, for example. Similarly, compression may cause areas bounded by each contact arm 120 to contract.#15157389v2

[0041] When compressed, conductive contact 100 may exhibit three points of contact 130 between portions of conductive contact 100. A first point of contact 130a may form between a region of the first spring contact arm 120a, such as may be proximate to the first spring portion 124a, and the intermediate portion 110. A second point of contact 130b may form between a region of the second spring contact 120b, such as may be proximate to the second spring portion 124b, and the intermediate portion 110. A third point of contact 130c may form between the first spring contact arm 120a and the second spring contact arm 120b.

[0042] The three points of contact 130 may conceptually define a triangle. The dimension of this triangle — as two examples, the area of the triangle and a height of the triangle to the third point of contact 130c — may in some embodiments impact the signal integrity of transmissions through the conductive contact 100. Accordingly, the dimensions and properties of the conductive contact 100 may be selected at least in part to provide a desired triangle dimension.

[0043] When uncompressed, conductive contact 100 may provide a single electrical path between the first mating contact portion 122a and the second mating contact portion 122b. When compressed, conductive contact may provide a plurality of electrical paths between the mating contact portions 122. For example, a first path may be formed through intermediate portion 110. A second path may be formed through first contact arm 120a and second spring portion 124b. A third path may be formed through first contact arm 120a and second contact arm 120b. As apparent from FIG. IB, further additional conductive paths may also be formed between the mating contact portions 122.

[0044] Conductive contact 100 may have any suitable dimensions. Dimensions of conductive contact 100 may be selected based at least in part on desired mechanical performance of conductive contact 100. For example, dimensions of conductive contact 100 may, along with materials of conductive contact 100, impact a spring response of conductive contact 100.

[0045] In some embodiments, conductive contact 100 may have an uncompressed height, for example measured from the first mating contact portion 122a to the second mating contact portion 122b, of less than 4 mm, less than 3 mm, and / or less than 2 mm. For example, the height may be 2.35 mm. In some embodiments, conductive contact 100 may have a compressed height of less than 3.5 mm, less than 2.5 mm, and / or less than 1.5 mm. For example, the compressed height may be 1.85 mm.

[0046] In some embodiments, conductive contact 100 may have a width, for example measured orthogonal to a plane of a conceptual triangle formed by points of contact 130, of less#15157389v2than 0.5 mm, less than 0.25 mm, and / or less than 0.1 mm. For example, the width may be 0.12 mm.

[0047] In some embodiments, conductive contact 100 may have a thickness, for example measured at a center of the intermediate portion 110 orthogonal to the width and orthogonal to the height, of less than 0.2 mm, less than 0.075 mm, and / or less than 0.03 mm. For example, the thickness may be 0.05 mm.

[0048] In some embodiments, conductive contact 100 may have, when uncompressed, a distance between spring contact arms 120 — for example, in a region where the third point of contact 130c is formed when conductive contact 100 is compressed — of less than 0.5 mm, less than 0.2 mm, and / or less than 0.075 mm. For example, the distance may be 0.1 mm.

[0049] In some embodiments, conductive contact 100 may have, when uncompressed, a distance between spring portions 124 and intermediate portion 110 of less than 0.5 mm, less than 0.2 mm, and / or less than 0.075 mm. For example, the distance may be 0.1 mm.

[0050] Conductive contact 100 may be configured such that at least one point of contact 130 is formed before conductive contact 100 is fully compressing. For example, for a conductive contact 100 having an uncompressed height of 2.35 mm and a compressed height of 1.85 mm, at least one point of contact 130 may form when the conductive contact 100 is partially compressed to a height of 2.1 mm. Providing points of contact 130 when conductive contact 100 is partially compressed may be desirable to provide consistent electrical performance over a range of compression forces, for example to account for manufacturing tolerances of components which may be mated to conductive contact 100 resulting in variable compression forces.

[0051] FIG. 2A illustrates a perspective view of an alternative conductive contact 200 in an uncompressed state, according to an embodiment of the present technology. FIG. 2B illustrates a perspective view of the conductive contact 200 in a compressed state, according to an embodiment of the present technology.

[0052] As shown, conductive contact 200 includes an intermediate portion 210, spring-loaded contact arms 220 extending from opposite ends of intermediate base portion 210, and a tongue portion 212 extending from intermediate base portion 210. As shown, each contact arm 220 has a mating contact portion 222 and terminates at a spring portion 224.

[0053] Mating may cause conductive contact 200 to compress. For example, a first mating electrical component may mate with and exert pressure on first mating contact portion 222a and a second mating electrical component may mate with and exert pressure on second mating contact portion 222b. The exerted pressure may cause the mating contact portions 222a#15157389v2and 222b to move toward one another, for example by bending. As a result, the contact arms 220a and 220b may also move toward one another.

[0054] Tongue portion 212 may have a length such that, when conductive contact 200 is compressed, first spring portion 224a and second spring portion 224b make electrical contact with tongue portion 212. As conductive contact 200 is further compressed, spring portions 224 may wipe along tongue portion 212, maintaining electrical contact therewith.

[0055] Accordingly, when contact 200 is compressed, a plurality of conductive electrical paths may be formed. A first conductive electrical path may be formed from first mating contact portion 222a to second mating contact portion 222b though intermediate base portion 210. A second conductive electrical path may be formed through first spring portion 224a, tongue portion 212, and second spring portion 224b. A third conductive electrical path may be formed through first spring portion 224a, tongue portion 212, and intermediate base portion 210. A fourth conductive electrical path may be formed through intermediate base portion 210, tongue portion 212, and second spring portion 224b.

[0056] Conductive contact 200 may have, for example, dimensions in the same range and selected based on the same considerations as conductive contact 100. Conductive contact 200 may have a thickness which is substantially constant across regions of conductive contact 200. Substantially constant thickness may improve ease of manufacture and / or signal integrity of transmissions through conductive contact 200, for example.

[0057] As described in conjunction with conductive contact 100, it may be desirable to provide for electrical contact with the spring portions 224 when conductive contact 200 is partially compressed. Accordingly, tongue portion 224 may have a length such that spring portions 224 initially make contact with a different region of tongue portion 212 — for example, a region distal to the intermediate portion 210 — than the spring portions 224 contact when conductive contact 200 is fully compressed.

[0058] Having thus described multiple embodiments of conductive contacts according to aspects of the technology disclosed herein, an example interposer and system in which such conductive contacts may be integrated will be described in conjunction with FIGs. 3 and 4. FIGs. 3 and 4 represent one example of an implementation of the conductive contacts in an electrical component. As described elsewhere, the conductive contacts may be included in other types of electrical components in any number.

[0059] FIG. 3 illustrates an interposer 420 having a plurality of electrical contacts of the types described herein.#15157389v2

[0060] Interposer 420 includes an interposer housing 422. Interposer housing 422 includes a first surface 424 and a second surface 426 opposite first surface 424. Interposer housing 422 holds a plurality of contacts 430 arranged in an array. Each contact 430 includes a first mating portion 432 that is exposed at first surface 424 and a second mating portion 434 that is exposed at second surface 426. Being exposed outside the interposer housing 422, the first mating portions 432 allow for electrical connections with a first substrate and the second mating portions 434 allow for electrical connections with a second substrate, for example. Interposer housing 422 may include contact slots through which the bodies of the contacts 430 are passed and retained.

[0061] As described previously, each contact 430 of an interposer 420 may provide two (or more) conductive paths through the contact 430. Providing multiple conductive paths may reduce the overall contact inductance and the overall contact resistance and short out electrical stubs that would otherwise be formed by the distal portions of the contact arms, thereby improving signal integrity. Because tank resonance may be associated with an inductance and a capacitance of the contact, reducing the overall contact inductance may mitigate the formation of tank resonance within an operating frequency range of the interposer 420.

[0062] FIG. 4 is a perspective view of an electronic assembly 400 including the interposer 420, in accordance with some embodiments. Electronic assembly 400 further includes a first substrate 410 and a second substrate 440 and another electronic component 450. In some embodiments, first substrate 410 and second substrate 440 may be part of respective electronic components. For example, first substrate 410 may be a PCB (e.g., a motherboard) and second substrate 440 may be a semiconductor card (e.g., a processor card). In such arrangements, interposer 420 may be a portion of a chip socket including mounting hardware attached to substrate 410 (not shown for simplicity of illustration). Alternatively, second substrate 440 may also be a PCB or a connector carrying cables connected to a device positioned outside electronic assembly 400. First substrate 410 and second substrate 440 may be any suitable electronic components. Accordingly, interposer 420 may provide connection between any suitable electronic components without limitation to the examples explicitly described herein.

[0063] In electronic assembly 400, the electrical interface of first substrate 410 is in a plane parallel to the plane of the electrical interface of second substrate 440. In the example of FIG. 4, second substrate 440 includes pads 442 formed on a first surface 444 of second substrate 440 that faces first substrate 410, and first substrate 410 includes pads 412 formed on a first surface 414 of first substrate 410 that faces second substrate 440, where the first surface 444 of#15157389v2second substrate 440 is parallel to the first surface 414 of first substrate 410. During operation, pads 442 are electrically connected to pads 412 via interposer 420.

[0064] The separation between the first and second substrates 410 and 440, and consequently, the thickness of interposer 420 (in the direction separating first and second substrates 410 and 440), may be sufficiently large to allow electronic component 450 to fit near interposer 420 between first and second substrates 410 and 440. In some embodiments, electronic component 450 has a height in excess of 1.8 mm. Electronic component 450 may include, for example, a bank of memory cards or may be a connector terminating a plurality of cables carrying signals that pass through interposer 420 to components on second substrate 440. In some embodiments, the lateral extension of second substrate 440 is such that electronic component 450 lies at least partially between first and second substrates 410 and 440 (e.g., with second substrate 440 at least partially covering electronic component 450). In these embodiments, in order to ensure a reliable connection between first and second substrates 410 and 440, interposer 420 (and, consequently, contacts 430) should be taller than electronic component 450 in the direction separating first and second substrates 410 and 440.

[0065] Interposer 420 may be mounted to first substrate 410 (using posts, bolts, latches, or other hardware not shown for simplicity), and electrical connections may be formed via spring-loaded contact arms of contacts 430. For example, the spring-loaded contact arms may be exposed at a first surface of interposer 420 that faces first substrate 410. Latching structures (not shown in FIG. 1) may retain interposer 420 in place on first substrate 410, thereby allowing the spring-loaded contact arms of contacts 430 to produce a force towards first substrate 410.Further, spring-loaded contact arms of contacts 430 may be exposed at a second surface of interposer 420 that faces second substrate 440, and second substrate 440 may be pressed toward the second surface. Electronic assembly 400 may include posts, bolts, latches, or other hardware (not shown in FIG. 1) to hold second substrate 440 to the interposer 420 and to press the second substrate 440 against the exposed spring-loaded contact arms of the contacts 430. In some embodiments, the spring-loaded contact arms of the contacts 430 of the interposer 420 that face second substrate 440 may be compliant and may exert a force against pads 442 when second substrate 440 is pressed against the interposer 420. Similarly, the spring-loaded contact arms of the contacts 430 of the interposer 420 that face first substrate 410 may be compliant and may exert a force against pads 412 when first substrate 410 is pressed against the interposer 420.

[0066] Having thus described several embodiments, it is to be appreciated various alterations, modifications, and improvements may readily occur to those skilled in the art. Such#15157389v2alterations, modifications, and improvements are intended to be within the spirit and scope of the invention.

[0067] For example, some contacts are described as signal contacts. Similar contacts may be used as ground contacts. In some embodiments, signal and ground contacts may be differentiated based on shape, with the ground contacts being wider than signal contacts of some or all of their length. Alternatively, they may be differentiated by position, with signal contacts being positioned in pairs between ground contacts, for example in a ground, signal, signal, ground (GSSG) pattern, where adjacent signal contacts form a differential pair. Alternatively, the contacts may be arranged in a signal, ground, signal (SGS) pattern. The ground contacts may electrically connect to a ground plane of a substrate.

[0068] As another example, electrical connectors have been described herein as having contacts arranged in an array having rows and columns, which may be a rectangular array, and / or may be non-rectangular and / or irregular. It should be appreciated that, examples described herein in reference to rows and columns may apply generally to dimensions of non-rectangular, irregular, and / or other types of arrays.

[0069] A chip socket has been described as an example of a component containing an interposer. Techniques as described herein may be used to construct an interposer used for any suitable purpose, such as to join two parallel printed circuit boards. Similarly, a printed circuit board was used as an example of a substrate with conductive structures to be connected to another device through an interposer. Techniques as described herein may be used to connect any suitable substrate to another electronic component.

[0070] In some configurations, a semiconductor device with a Ball Grid Array or Land Grid Array may be connected to the board through the interposer. Alternatively, or additionally, the component may be the end of a flexible printed circuit. Accordingly, it should be appreciated that a component with a substrate having contact pads thereon may be pressed against the interposer to make electrical connections.

[0071] In some embodiments, a compressive force is applied to an interposer as a result of a lid being closed with some mechanism to bias the lid towards the interposer. That mechanism may include spring-like members with camming surfaces formed as part of the frame, for example. Similar spring-like members may be formed as part of a sheet-metal shell surrounding the frame and / or the interposer.

[0072] Further, though advantages of the present invention are indicated, it should be appreciated that not every embodiment of the invention will include every described advantage. Some embodiments may not implement any features described as advantageous herein and in#15157389v2some instances. Accordingly, the foregoing description and drawings are by way of example only.

[0073] Various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.

[0074] Also, the invention may be embodied as a method. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.

[0075] Also, circuits and modules depicted and described may be reordered in any order, and signals may be provided to enable reordering accordingly.

[0076] Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.

[0077] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0078] The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”

[0079] As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.

[0080] The phrase “and / or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are#15157389v2conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and / or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and / or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and / or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[0081] Also, the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” “having,” “containing,” or “involving,” and variations thereof herein, is meant to encompass the items listed thereafter (or equivalents thereof) and / or as additional items.#15157389v2

Claims

CLAIMSWhat is claimed is:

1. A contact for a signal connector, the contact comprising:an intermediate portion; anda first compliant arm extending from the intermediate portion in a first direction, the first compliant arm comprising a first contact tip,wherein the first compliant arm is configured to bend in response to compression of the contact in the first direction so that the first contact tip contacts the intermediate portion.

2. The contact of claim 1, further comprising a second compliant arm extending from the intermediate portion in a direction opposite the first direction, the second compliant arm comprising a second contact tip, wherein the second compliant arm is configured to bend in response to compression of the contact in the first direction so that the second contact tip contacts the intermediate portion.

3. The contact of claim 2, wherein the first compliant arm and second compliant arm are configured to contact each other when the contact is compressed in the first direction.

4. The contact of claim 1, configured to from a single electrical signal path between upper and lower contact points in an uncompressed state and to form multiple signal paths between the upper and lower contact points in a compressed state.

5. The contact of claim 1, wherein the contact has a height along the first direction in a fully compressed state in excess of 1.8 mm and less than 3 mm.

6. The contact of claim 5, wherein the contact has a width along a second direction in the fully compressed state in excess of 0.01 mm and less than 0.5 mm.

7. The contact of claim 1, wherein:the contact is a first contact of a differential signal pair, anda second contact of the differential signal pair is symmetrically oriented with respect to ground.#15157389v28. The contact of claim 7, wherein the first contact and the second contact are arranged back-to-back or front-to-front.

9. The contact of claim 7, wherein the symmetrical orientation of the differential signal pair is configured to mitigate mode conversion.

10. A contact for a signal connector, the contact comprising:an intermediate portion;a first compliant arm extending from the intermediate portion in a first direction, the first compliant arm comprising a first contact region; anda projection extending from the intermediate portion in a second direction perpendicular to the first direction,wherein upon compression of the contact in the first direction the first contact region of the first compliant arm is configured to contact the projection, andwherein the contact has a substantially constant thickness.

11. The contact of claim 10, wherein the projection is substantially straight.

12. The contact of claim 10, wherein the projection is configured to extend beyond the first contact region when the contact is compressed in the first direction.

13. The contact of claim 10, further comprising a second compliant arm extending from the intermediate portion and having a second contact region, wherein upon compression of the contact in the first direction the second contact region of the second compliant arm is configured to contact the projection.

14. The contact of claim 13, wherein the first compliant arm has a third contact region and the second compliant arm has a fourth contact region, and wherein in response to compression of the contact in the first direction by contacting the third and fourth contact regions, the contact is configured to provide two signal paths between the third contact region and fourth contact region.

15. The contact of claim 10, wherein the first compliant arm is more compliant in the first direction than it is in a third direction perpendicular to the first direction.#15157389v216. The contact of claim 10, wherein the first compliant arm comprises a first curved region positioned, along a length of the first compliant arm, between the intermediate portion and the first contact region, wherein the first curved region has a first convex region facing in the first direction and a first concave region facing away from the first direction.

17. The contact of claim 10, wherein an inductance of the contact is reduced when the first contact region of the first compliant arm contacts the projection.

18. The contact of claim 10, wherein a tank resonance of the contact is changed when the first contact region of the first compliant arm contacts the projection.

19. The contact of claim 10, wherein:the contact is a first contact of a differential signal pair, anda second contact of the differential signal pair is symmetrically oriented with respect to ground.

20. The contact of claim 19, wherein the symmetrical orientation of the differential signal pair is configured to mitigate mode conversion.#15157389v2

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