1.-2. Retainer ring for semiconductor wafer polishing

Abstract

1. This article is used to hold a substrate and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view; the broken lines shown in reproductions 1.1 to 1.11 are for illustrative purposes only and form no part of the claimed design; the dash-dot-dash lines in reproductions 1.2, 1.10 and 1.11 are included to show a partially enlarged view only and form no part of the claimed design; reproduction 1.6 is a cross-sectional view taken along the line 1.6-1.6 in reproduction 1.3; reproduction 1.7 is a cross-sectional view taken along the line 1.7-1.7 in reproduction 1.3; reproduction 1.8 is an enlarged view of the portion defined by arrows 1.8 in reproduction 1.6.; reproduction 1.9 is an enlarged view of the portion defined by arrows 1.9 in reproduction 1.7; reproduction 1.10 is an enlarged view of the portion 1.10 in reproduction 1.2; reproduction 1.11 is an enlarged view of the portion 1.11 in reproduction 1.2.; 2. This article is used to hold a substrate and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view; the broken lines shown in reproductions 2.1 to 2.11 are for illustrative purposes only and form no part of the claimed design; the dash-dot-dash lines in reproductions 2.2, 2.10 and 2.11 are included to show a partially enlarged view only and form no part of the claimed design; reproduction 2.6 is a cross-sectional view taken along the line 2.6-2.6 in reproduction 2.3; reproduction 2.7 is a cross-sectional view taken along the line 2.7-2.7 in reproduction 2.3; reproduction 2.8 is an enlarged view of the portion defined by arrows 2.8 in reproduction 2.6.; reproduction 2.9 is an enlarged view of the portion defined by arrows 2.9 in reproduction 2.7; reproduction 2.10 is an enlarged view of the portion 2.10 in reproduction 2.2; reproduction 2.11 is an enlarged view of the portion 2.11 in reproduction 2.2.

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