1.-6. Adhesive tape for manufacturing semiconductor device

Abstract

1. This article is an adhesive tape material used in the manufacturing process of semiconductor devices, such as for dicing semiconductor wafers and die bonding semiconductor chips obtained through dicing; this article is equipped with a barcode near the bonding layer, which cannot be used due to the presence of foreign objects; the barcode is attached to the surface of the base material; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; this article is continuous only in the left-right direction in the front view; novelty resides in the shape and configuration as shown in the representations; the dicing tape is transparent; reproduction 1.8 is an enlarged sectional view cut along A-A line shown in the reproduction 1.1; reproduction 1.9 is an enlarged sectional view cut along B-B line and C-C line shown in the reproduction 1.1; reproduction 1.10 is an enlarged view of D-D and E-E portion in the reproduction 1.1; reproduction 1.11 is an enlarged view of F-F portion in the reproduction 1.8; reproduction 1.12 is a reference exploded view of design 1.; 2. This article is an adhesive tape material used in the manufacturing process of semiconductor devices, such as for dicing semiconductor wafers and die bonding semiconductor chips obtained through dicing; this article is equipped with a barcode near the bonding layer, which cannot be used due to the presence of foreign objects; the barcode is attached to the surface of the base material; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; this article is continuous only in the left-right direction in the front view; novelty resides in the shape and configuration as shown in the representations; the dicing tape is transparent; reproduction 2.8 is an enlarged sectional view cut along A-A line shown in the reproduction 2.1; reproduction 2.9 is an enlarged sectional view cut along B-B line and C-C line shown in the reproduction 2.1; reproduction 2.10 is an enlarged view of D-D and E-E portion in the reproduction 2.1; reproduction 2.11 is an enlarged view of F-F portion in the reproduction 2.8; reproduction 2.12 is a reference exploded view of design 2.; 3. This article is an adhesive tape material used in the manufacturing process of semiconductor devices, such as for dicing semiconductor wafers and die bonding semiconductor chips obtained through dicing; this article has markings at positions overlapping with the bonding layer that cannot be used due to the presence of foreign objects, and these markings are applied to the surface of the base material; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; this article is continuous only in the left-right direction in the front view; novelty resides in the shape and configuration as shown in the representations; the dicing tape is transparent; reproduction 3.8 is an enlarged sectional view cut along A-A line shown in the reproduction 3.1; reproduction 3.9 is an enlarged sectional view cut along B-B line shown in the reproduction 3.1; reproduction 3.10 is an enlarged view of C-C portion in the reproduction 3.8; reproduction 3.11 is an enlarged view of D-D portion in the reproduction 3.9; reproduction 3.12 is a reference exploded view of design 3.; 4. This article is an adhesive tape material used in the manufacturing process of semiconductor devices, such as for dicing semiconductor wafers and die bonding semiconductor chips obtained through dicing; this article has markings at positions overlapping with the bonding layer that cannot be used due to the presence of foreign objects, and these markings are applied to the surface of the base material; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; each article is continuous only in the left-right direction in the front view; novelty resides in the shape and configuration as shown in the representations; the dicing tape is transparent; reproduction 4.8 is an enlarged sectional view cut along A-A line shown in the reproduction 4.1; reproduction 4.9 is an enlarged sectional view cut along B-B line shown in the reproduction 4.1; reproduction 4.10 is an enlarged view of C-C portion in the reproduction 4.8; reproduction 4.11 is an enlarged view of D-D portion in the reproduction 4.9; reproduction 4.12 is a reference exploded view of design 4.; 5. This article is an adhesive tape material used in the manufacturing process of semiconductor devices, such as for dicing semiconductor wafers and die bonding semiconductor chips obtained through dicing; this article is equipped with a product name display section near the bonding layer, and the product name display section is applied to the surface of the base material; this article does not have a product name display section near the bonding layer that cannot be used due to the presence of foreign objects; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; this article is continuous only in the left-right direction in the front view; novelty resides in the shape and configuration as shown in the representations; the dicing tape is transparent; reproduction 5.8 is an enlarged sectional view cut along A-A line shown in the reproduction 5.1; reproduction 5.9 is an enlarged sectional view cut along B-B line shown in the reproduction 5.1; reproduction 5.10 is an enlarged view of C-C portion in the reproduction 5.8; reproduction 5.11 is a reference exploded view of design 5.; 6. This article is an adhesive tape material used in the manufacturing process of semiconductor devices, such as for dicing semiconductor wafers and die bonding semiconductor chips obtained through dicing; this article is equipped with a product name display section near the bonding layer, and the product name display section is applied to the surface of the base material; this article does not have a product name display section near the bonding layer that cannot be used due to the presence of foreign objects; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; the two double-dashed lines represent the omitted intermediate portion; novelty resides in the shape and configuration as shown in the representations; the dicing tape is transparent; reproduction 6.8 is an enlarged sectional view cut along A-A line shown in the reproduction 6.1; reproduction 6.9 is an enlarged sectional view cut along B-B line shown in the reproduction 6.1; reproduction 6.10 is an enlarged view of C-C portion in the reproduction 6.8; reproduction 6.11 is a reference exploded view of design 6.

Images