Photosensitive film

Abstract

This article is a photosensitive film used for circuit formation on wiring boards such as semiconductor package substrates; a step portion is formed on the winding core of this article, and the film is wound starting from this step portion; as a result, this article prevents the formation of a step mark on the film because no step is created in the overlapping portion at the starting end of the film winding; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed design; the alternating long and short lines define bounds of the claimed design and form no part thereof; reproduction 1.8 is an enlarged view of A-A and B-B portion in the reproduction 1.5; reproduction 1.9 is an enlarged sectional view cut along G-G line shown in the reproduction 1.1 and C-C line shown in the reproduction 1.8; reproduction 1.10 is an enlarged sectional view cut along G-G line shown in the reproduction 1.1 and D-D line shown in the reproduction 1.8; reproduction 1.11 is an enlarged view of E-E and F-F portion in the reproduction 1.7.

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