Semiconductor module

WO248241SActive Publication Date: 2025-12-26SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information

Application Number
WO248241
Authority / Receiving Office
WO · WO
Patent Type
Designs
Current Assignee / Owner
Priority Date
2024-07-02
Filing Date
2024-12-23
Publication Date
2025-12-26
Estimated Expiration
2049-12-23

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Abstract

This item is a semiconductor module (dual inline package semiconductor module) with a heat sink exposed on one side surface (the bottom side surface); it has multiple terminals extending from the sides, with the tips of these terminals being either single or bifurcated; these terminals are arranged symmetrically in the longitudinal direction of each side.
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