Semiconductor module

WO249172SActive Publication Date: 2026-02-20SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information

Application Number
WO249172
Authority / Receiving Office
WO · WO
Patent Type
Designs
Current Assignee / Owner
Priority Date
2024-08-23
Filing Date
2025-02-18
Publication Date
2026-02-20
Estimated Expiration
2050-02-18

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Abstract

This product is a semiconductor module equipped with an electronic component inside; it has terminals, external communication function terminals, housing fixing holes, and heat dissipation fins on the top surface of a rectangular body; the areas formingthe housing fixing holes also serve as terminals.
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