Grain milling device

Abstract

Provided is a grain milling device 100 comprising: a cylindrical casing 10 obtained by continuously providing a plurality of divided porous wall parts 11 so as to form a cylindrical shape; and a grain milling roll 30 rotatably arranged inside of the cylindrical casing 10, wherein a grain milling chamber 15 is formed between the inner peripheral surface of the cylindrical casing 10 and the outer peripheral surface of the grain milling roll 30. The inner peripheral surface of the cylindrical casing 10 is provided with a grinding part 13 that is contacted by grains, and the grinding part 13 includes a plurality of protrusions 1311 protruding toward the inner peripheral surface of the cylindrical casing 10. The protrusions 1311 are each configured such that a projecting member 1313 is attachable to / detachable from a fitting hole 1312 formed in the grinding part 13.

Description

grain milling equipment

[0001] The present invention relates to a grain polishing device capable of removing the germ and pericarp of grains.

[0002] Conventionally, the germ and pericarp of corn have been removed using grain polishing devices. For example, Patent Document 1 discloses a device in which a rotor is disposed inside a polishing drum having a porous wall portion (sieve portion) and a sanding surface (protrusions), and a gap between the polishing drum and the rotor is formed in a germ removal chamber (working chamber).

[0003] The inner surface of the grinding drum is configured such that perforated walls forming the sieve section and file surfaces forming the file section are alternately arranged in the direction of rotation of the rotor, so that the corn wear debris formed in the file section can be immediately removed from the germ removal chamber in the sieve section.

[0004] Special Publication No. 8-501984

[0005] However, in the conventional device described above, the protrusions on the file surface wear out in proportion to the operating time of the device, so the entire file surface needs to be replaced, which increases the effort required to replace the file surface and the cost of the replacement file surface.

[0006] In view of the above-mentioned problems, the present invention aims to provide a grain polishing device that can reduce the effort and cost required for replacing replacement parts in the grain polishing device.

[0007] One aspect of the present invention is a grain polishing device comprising a cylindrical casing formed by connecting multiple divided porous wall sections, and a grain polishing roll rotatably arranged within the cylindrical casing, wherein a grain polishing chamber is formed between the inner surface of the cylindrical casing and the outer surface of the grain polishing roll, wherein the inner surface of the cylindrical casing is provided with a grinding section with which the grain comes into contact, the grinding section has a grinding surface on the inner surface side of the grinding section, and the grinding surface has multiple convex sections that protrude inward beyond the grinding surface in the circumferential direction and in the direction of the rotation axis of the cylindrical casing, and the convex sections are configured so that protruding members can be attached and detached to fitting holes formed on the grinding surface.

[0008] The grinding portion may be disposed between the two porous wall portions and may be a plurality of grinding portions disposed within the cylindrical casing.

[0009] The cylindrical casing may include a plurality of pillars supporting an upper end and a lower end of the cylindrical casing, and the grinding portion may be disposed on the pillars.

[0010] The grinding section may be divided into an upper grinding section and a lower grinding section, and the upper grinding section and the lower grinding section may have different grinding surfaces.

[0011] A spring pin may be fitted into the protrusion.

[0012] According to one aspect of the present invention, a grinding portion is provided on the inner surface of the cylindrical casing of the grain polishing device, and multiple detachable protrusions are provided on the grinding portion, making it possible to replace only the worn protrusions without replacing the entire grinding portion, thereby significantly reducing the costs associated with maintaining the grain polishing device compared to conventional methods.

[0013] Fig. 1 is a schematic cross-sectional view of a grain polishing device in one embodiment of the present invention. Fig. 2 is an exploded oblique view of a grain polishing unit in one embodiment of the present invention. Fig. 3 is a cross-sectional view of the grain polishing unit in one embodiment of the present invention. Fig. 4 is a perspective view of a cylindrical casing of the grain polishing unit in one embodiment of the present invention. Fig. 5 is a perspective view of a cylindrical casing showing the arrangement of a grinding unit in one embodiment of the present invention. Fig. 6 is a plan view and a side view of the grinding unit in one embodiment of the present invention. Fig. 7 is a perspective view of a grinding unit showing the installation of a spring pin in the grinding unit in one embodiment of the present invention. Fig. 8 is a side view of a spring pin and a diagram explaining the dimensions of the spring pin in one embodiment of the present invention.

[0014] Hereinafter, one embodiment of a grain polishing apparatus of the present invention will be described with reference to the drawings.

[0015] Figure 1 shows a schematic cross-sectional view of a grain polishing apparatus 100 according to one embodiment of the present invention. The grain polishing apparatus 100 is capable of removing germs and pericarp from grains such as corn. Specifically, the grain polishing apparatus 100 includes at least a drive motor 40 for rotating the grain polishing roll 30 of the grain polishing section 1 shown in Figure 2, a blower 50 for blowing air to the grain polishing section 1, a supply section 60 for supplying grains to the grain polishing section 1, and a discharge section 20 for discharging the grain germs. The grain polishing apparatus 100 can also polish rice, barley, and other grains.

[0016] 2 shows an exploded perspective view of the grain polishing unit 1 in this embodiment. The grain polishing roll 30 is surrounded by a cylindrical casing 10 having a plurality of divided screens 11 arranged in series, each of which serves as a porous wall. A frame 12 that covers the screens 11 is arranged on the outer periphery of the cylindrical casing 10.

[0017] Figure 3 shows a cross-sectional view of the grain polishing unit 1 as seen from above, and Figure 4 shows a perspective view of the cylindrical casing 10. As shown in the figure, a grain polishing chamber 15 (see Figure 3) is formed between the inner peripheral surface of the cylindrical casing 10 and the outer peripheral surface of the grain polishing roll 30, and the grain is polished while flowing as shown by the arrows.

[0018] In this embodiment, in addition to the screen 11, an abrasive plate 13, which serves as a grinding portion that grinds the grain, is provided on the inner peripheral surface of the cylindrical casing 10. As shown in Figures 3 and 4, the abrasive plate 13 is disposed between the two screens 11 and a plurality of abrasive plates 13 are disposed inside the cylindrical casing 10.

[0019] In this embodiment, four pillars 14 are provided to support the upper and lower ends of the cylindrical casing 10, and the abrasive plate 13 is disposed on the pillars 14. Fig. 5 shows an embodiment in which the abrasive plate 13 is attached to the four pillars 14 of the cylindrical casing 10. In this embodiment, the abrasive plate 13 is divided into upper and lower parts, and is composed of an upper abrasive plate 131 (upper grinding portion) and a lower abrasive plate 132 (lower grinding portion).

[0020] As shown in the enlarged view of Figure 5 and the plan view and side view of the abrasive plate 13 in Figure 6, the abrasive plate 13 is formed with a plurality of protrusions 1311 that protrude from the inner surface of the cylindrical casing 10.

[0021] More specifically, as shown in FIG. 7, a plurality of fitting holes 1312 are formed on the grinding surface of the abrasive plate 13, and spring pins 1313, which are protruding members, are inserted into the fitting holes 1312 so that they protrude 0.5 to 3 mm from the plate surface.

[0022] The abrasive plate 13 of this embodiment has a flat plate with a fitting hole 1312 of a predetermined size drilled therein, and a spring pin 1313 as shown in Fig. 8 is inserted into the fitting hole 1312 to form a protrusion 1311. That is, by hammering the spring pin 1313 into the fitting hole 1312, the outer diameter of the spring pin 1313 is reduced, and the spring pin 1313 is fixed in place by the repulsive force.

[0023] The spring pins 1313 are hammered into the fitting holes 1312 and fixed in place. Therefore, when all or part of the spring pins 1313 reach the end of their wear life, it is possible to replace only the spring pins 1313 to be replaced, without replacing the abrasive plate 13. This configuration makes it possible to significantly reduce maintenance costs compared to conventional methods.

[0024] The size of the spring pin 1313 is not particularly limited, and for example, a spring pin 1313 having an outer diameter of 2 to 5 mm as shown in FIG. 8 can be used.

[0025] The spring pins 1313 form the protrusions 1311 on the abrasive plate 13, and the grinding action of the abrasive plate 13 makes it possible to effectively separate, for example, the endosperm portion of corn from the germ and pericarp.

[0026] That is, with the above-described configuration, the protruding portion of the spring pin 1313 has more opportunities to collide with the germ portion of the corn kernel in the grain polishing chamber 15, making it possible to efficiently separate the germ from the endosperm portion while maintaining a low internal pressure in the grain polishing chamber 15. Furthermore, by being able to maintain a low internal pressure in the grain polishing chamber 15, the frictional force between the kernels is reduced, reducing the crushing of the endosperm portion and making it possible to suppress the generation of powdery matter.

[0027] In addition, the amount of powdery matter discharged outside the grain polishing chamber 15 can be reduced, improving product yield. Furthermore, the protruding portion of the spring pin 1313 exerts a grinding action on the endosperm surface, and the pericarp is also separated from the endosperm portion, making it possible to prevent a decline in polished grain quality.

[0028] Furthermore, by lowering the internal pressure of the grain polishing chamber 15, it is possible to extend the wear life of components such as the screen 11 and abrasive plate 13 arranged on the inner surface of the cylindrical casing 10.

[0029] Other Embodiments Although one embodiment of the present invention has been described above with reference to the drawings, the grain polishing device of the present invention is not necessarily limited to the above-described embodiment.

[0030] For example, the number of spring pins 1313 installed on the abrasive plate 13 is not particularly limited. The upper abrasive plate 131 and the lower abrasive plate 132 shown in the figure are each 250 cm ２ It is preferable that 100 to 300 spring pins 1313 are provided on each ground surface to form the convex portions 1311. That is, the number of spring pins 1313 provided per unit area on the ground surface is 0.4 to 1.2 pins / cm. ２ This becomes:

[0031] In addition, in the above-described embodiment, the abrasive plates 13 are arranged on the pillar portions 14 at four locations, but this is not necessarily limited to this, and it is also possible to arrange the abrasive plates 13 at three or five locations within the cylindrical casing 10.

[0032] In the above-described embodiment, the abrasive plate 13 is divided into an upper abrasive plate 131 and a lower abrasive plate 132, but this division is not essential and the abrasive plate 13 may be a single abrasive plate 13. Furthermore, the division of the abrasive plate 13 is not limited to two as described above, but may be three or more. In addition, the division of the abrasive plate 13 is not necessarily limited to the vertical division as described above, but may also be in the rotation direction of the grain polishing roll 30.

[0033] In addition, in the above-described embodiment, the upper abrasive plate 131 and the lower abrasive plate 132 have the same grinding surface as shown in Fig. 5, but it is also possible to configure the upper and lower abrasive plates 131 and 132 to have different grinding surfaces. In other words, by arranging the upper abrasive plate 131 and the lower abrasive plate 132 with different grinding effects depending on the type of raw grain and the grain polishing conditions, it is possible to obtain the optimal grinding effect for the target grain.

[0034] In the above-described embodiment, the most preferred example is an embodiment in which a spring pin 1313 is inserted as the protrusion 1311. However, it is not necessarily limited to the spring pin 1313, and a round bar or other object with a hook shape can be used, and anything that can be detached and replaced can be used.

[0035] Although one embodiment of the present invention and other embodiments have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention includes equivalents thereof. Furthermore, the components described in the claims and specification may be combined or omitted to the extent that at least part of the above-described problems can be solved or at least part of the effects can be achieved.

[0036] DESCRIPTION OF SYMBOLS 1 Grain polishing section 10 Cylindrical casing 11 Screen (perforated wall section) 12 Frame 13 Abrasive plate (grinding section) 131 Upper abrasive plate (upper grinding section) 132 Lower abrasive plate (lower grinding section) 1311 Convex section 1312 Fitting hole 1313 Spring pin (protruding member) 14 Pillar section 15 Grain polishing chamber 20 Discharge section 30 Grain polishing roll 40 Drive motor 50 Air blower 60 Supply section 100 Grain polishing device

Claims

1. A grain polishing device comprising a cylindrical casing formed into a cylindrical shape by connecting multiple divided porous wall sections, and a grain polishing roll rotatably arranged inside the cylindrical casing, wherein a grain polishing chamber is formed between the inner surface of the cylindrical casing and the outer surface of the grain polishing roll, wherein the inner surface of the cylindrical casing is provided with a grinding section with which grains come into contact, the grinding section has a grinding surface on the inner surface side of the grinding section, and the grinding surface is provided with a plurality of protruding sections that protrude inward beyond the grinding surface in the circumferential direction and in the direction of the rotation axis of the cylindrical casing, and the protruding sections are configured so that protruding members can be attached and detached to fitting holes formed on the grinding surface.

2. The grain polishing device according to claim 1, wherein the grinding section is disposed between two of the porous wall sections and a plurality of grinding sections are disposed within the cylindrical casing.

3. The grain polishing device according to claim 2, wherein the cylindrical casing has a plurality of pillars supporting an upper end and a lower end of the cylindrical casing, and the grinding section is disposed on the pillars.

4. A grain polishing device according to any one of claims 1 to 3, wherein the grinding section is divided into an upper grinding section and a lower grinding section, and the upper grinding section and the lower grinding section have different grinding surfaces.

5. A grain polishing device according to any one of claims 1 to 3, wherein the protrusion has a spring pin fitted therein.

6. The grain polishing device according to claim 4, wherein the protrusion has a spring pin fitted therein.