Gypsum-based lightweight thermal insulation board and preparation method thereof

ZA202600111BActive Publication Date: 2026-09-30HENAN UNIV OF URBAN CONSTR
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Patent Information

Application Number
ZA202600111
Authority / Receiving Office
ZA · ZA
Patent Type
Patents
Current Assignee / Owner
Filing Date
2026-01-05
Publication Date
2026-09-30
Estimated Expiration
2046-01-05
Patent Text Reader

Abstract

The invention discloses a gypsum-based lightweight thermal insulation board and its preparation method, belonging to the technical field of building materials. The gypsum-based lightweight thermal insulation board includes the following raw materials in mass percentage: 55-85 percent of building gypsum, 15 percent of vitrified microbeads, 0-30 percent of phosphogypsum and 0-30 percent of high-strength gypsum. The preparation method of the gypsum-based lightweight thermal insulation board comprises the following steps: weighing each raw material according to mass percentage, mixing uniformly, adding water accounting for 50-70 percent of the total mass of the raw materials, stirring, pouring into a mold, performing natural curing and air-drying to obtain the gypsum-based lightweight thermal insulation board. As a core lightweight aggregate, vitrified microbeads may effectively improve the thermal insulation performance of the thermal insulation board, significantly reduce the density and thermal conductivity while maintaining sufficient mechanical strength. Meanwhile, it provides technical support for the high-value utilization of industrial solid wastes such as phosphogypsum, and is an important functional material for promoting the green and low-carbon transformation of building materials. The gypsum-based lightweight thermal insulation board of the invention uses building gypsum as the main cementitious material, supplemented with lightweight aggregates and industrial solid wastes, and has the characteristics of efficient thermal insulation, light weight and high strength.
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