Cleaning control system and method for sapphire double-polished wafers

Abstract

The present invention discloses a cleaning control system and method for sapphire double-polished wafers, belonging to the technical field of cleaning control for sapphire double-polished wafers. The present invention acquires cleaning data, including images of sapphire double-polished wafers and pre- and post-cleaning data, and processes the images; establishes a cleaning effect evaluation model, into which scratch-related parameters and the surface particle counts before and after cleaning are imported for evaluation; establishes a brush wear degree evaluation model, into which process parameters for cleaning sapphire double-polished wafers by the brush are imported to evaluate the wear degree of the brush; and establishes a brush remaining-service-life evaluation model, into which the brush wear loss, brush cleaning effect and brush thickness are imported to evaluate the remaining service life of the brush. According to the present invention, the cleaning effect is monitored in real time to evaluate the brush wear condition, and the brush service life is predicted based on the wear model, so as to reduce adverse impacts caused by the brush during the cleaning process of double-polished wafers. (Fig. 1)

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