Abrasion Apparatus TRIZ Cases
- Polishing Pad Pore Control via Surfactant Balance
Balanced surfactants control pore size during curing, eliminating mechanical foaming complexity.
- Thermosetting Polyurethane Foam Polishing Pad with Spherical Cells
Mechanical foaming creates spherical cells in a polyurethane polishing pad, eliminating solvent use while maintaining planarization stability.
- Nonwoven Abrasive With Flexible Binder Agglomerates
Flexible polyurethane binder agglomerates ceramic abrasive particles to improve surface finish while maintaining cutting efficiency.
- CMP Polishing Pad Window with UV-Transparent Polyurethane
A polyurethane window in a CMP polishing pad transmits ultraviolet light, enabling accurate endpoint detection at 250 nm.
- Fluoropolymer Polishing Pad for Wafer Backside Scratching
Optimized fluoropolymer pads reduce wafer backside scratching during cleaning, preventing photolithographic focus errors.
- Coated Abrasive Particle Deposition via Magnetic Field Segregation
Magnetic fields separate magnetizable and non-magnetizable abrasive particles for precise sequential deposition onto backing webs.
- Abrasive Delivery Polishing Pads with Dissolving Matrix
A polishing pad embeds water-soluble abrasive features within a polymer matrix to release particles at the interface.