Multi-mirror Fabry-Perot interferometer arrays use electrostatic actuators to tune resonance, resolving parallelism defects that degrade optical resolution.
A spintronic accelerometer detects acceleration by measuring resistance changes in a magnetic tunnel junction free layer that flexes during motion.
Dual acceleration sensors with different frequency sensitivities compensate for systematic measurement errors across varying dynamic conditions.
A MEMS sensor movable weight uses embedded high-density plugs to increase mass for improved detection sensitivity.
Through-holes in the beam reduce rigidity locally while protrusions isolate unwanted stress, maintaining a high signal-to-noise ratio.
Segmented mounting posts absorb thermal expansion via elastic deformation, decoupling strains from flexures to improve measurement accuracy.
A housing-mounted security arrangement detects door movement and activates a camera to capture images for remote monitoring.
Embedding tungsten or tantalum in silicon wells increases sensor mass without inducing stress, improving signal-to-noise ratio and measurement accuracy.
A fall detection apparatus calculates a triangle feature from acceleration and angular velocity data to identify user motion patterns.
A MEMS sensor device combines levitation and parallel plate forces to produce linear out-of-plane actuation of the proof mass.
Symmetrical H-shaped elastic beams reduce cross sensitivity and improve shock resistance in capacitive acceleration sensors.
A load measurement device uses acceleration sensors to detect orientation changes relative to gravity for accurate force determination.
An inertial force sensor employs an interlayer insulating layer to reduce capacitive coupling between driving and detection wiring.
Shielding lids cover recessed sensor parts to block electromagnetic noise and maintain uniform protection across all detection axes.
Bonding a circuit wafer with top electrodes to the device wafer avoids complex three-layer in-situ fabrication steps.
A shield part between fixed and movable electrode wiring minimizes parasitic capacitance, improving detection accuracy despite close wire spacing.
A sensor unit terminal design featuring a protruding portion that functions as a branched filler to reduce resin shrinkage stress.
Fluorine resin components thermally bond to seal sensor units without heat damage.
A metal reinforcement film on the fixed electrode side wall prevents etching damage and maintains structural integrity during sacrificial layer removal.
Information processing apparatus detects sensor faults by analyzing value correlations across different dynamic ranges.