See how porous Si3N4 or SiO2 preforms filled with molten gold, platinum, or palladium achieve h
Ordered 3D pore rows cut fluid pressure loss and contact resistance while improving bubble removal in water electrolysis electrodes.
Wafer-scale sintering film on carrier tape cuts handling damage and contamination while simplifying preform placement and protective layer removal.
An insulating coating and controlled particle size cut binder demand while preserving density, insulation, and green compact strength in dust cores.
Regularly arranged 3D pores and frameworks improve gas discharge, cut pressure loss, and support active material loading in electrolysis electrodes.