Cooling/Ventilation/Heating Modifications TRIZ Cases
- Fanless Electronic Device with Phase Change Material Microcapsule Layer
An electronic device directs hot air through side holes using an airflow guiding structure, reducing top plate temperature in compact fanless designs.
- Server Fan Airflow Shielding Structure Prevents Reversal
Pivoting shutter plates shield the fan from positive pressure airflow, preventing motor reversal and breakdowns during module replacement.
- Partition Plate Air Vent Cooling Redundancy
An opening in the partition plate links compartments to a single vent, resolving space constraints while maintaining cooling reliability.
- Enclosure Cooling Apparatus with Passive Heat Dissipation
An enclosure cooling apparatus directs airflow through intake and exhaust holes while using a heat sink to dissipate heat passively when the fan is inactive.