Current Conducting Devices TRIZ Cases
- High-Elongation Copper Foil Through Local Grain Refinement
Local grain refinement during electroplating suppresses bamboo-like microstructures in thin copper foil, improving elongation and battery reliability.
- Metal Electroplating Anodes with Partial Insulation
Partial anode insulation disperses current and suppresses organic additive decomposition without ancillary anode equipment.
- Proximity Mask Overhang to Reduce Wafer Plating Edge Effects
The mask tilts and reduces peripheral electrical fields, limiting mushroom profiles and improving wafer metal thickness uniformity.
- Ureylene Polymer Copper Plating Bath for Void-Free Via Filling
This acidic copper plating bath uses ureylene polymers and additive control for planar, void-free filling of vias and trenches.
- Boron-Doped Diamond Coating for Thermal Integrity
Electroplated refractory carbide and platinum-group layers protect boron-doped diamond substrates from oxidation while maintaining thermal conductivity.
- Magnetic Structure for Semiconductor Wafer Plating Uniformity
A magnetic structure applies Lorentz force to move metal ions away from the wafer edge and toward the center, resolving terminal effect non-uniformity.