Dielectric Materials TRIZ Cases
- Self-Assembled Conformal Coating for Printed Circuit Boards
Thixotropic rheology modifiers prevent coating sagging to maintain uniform thickness over complex geometries without vacuum deposition.
- Glass Resin Laminate with Uneven Surface for Fluoropolymer Adhesion
An uneven glass substrate with narrowed root convex portions anchors a tetrafluoroethylene polymer layer, resolving peel strength and warpage issues.
- Resin Substrate Gap Design for Via Conductor Stress Distribution
A resin substrate incorporates a gap adjacent to via conductor bonding portions to distribute mechanical stress and mitigate structural damage.
- Ultra-thin Tempered Glass Sensor Cover with Lamination
Ion-exchanged glass combined with a low-modulus underlay resolves the contradiction between puncture resistance and signal-to-noise ratio in sensor covers.
- Semiconductor Device Solder Dam for Flow Restriction
An inorganic dam material restricts solder flow on a metal base, eliminating organic resist outgassing and improving manufacturing reliability.
- Cyanate Ester Resin for Low-Loss PCBs
Copolymerized cyanate ester resin reduces dielectric loss in high-frequency laminates, solving signal integrity issues.