Dielectric Materials TRIZ Cases
- PCBA Metamaterial Ground Plane Arc Resistance
Nickel-doped metamaterial layers embedded in PCBA ground planes increase capacitance to prevent premature arcing across dielectric surface switches.
- Terahertz Metamaterials on Thin Membranes
Suspended resonator arrays on thin membranes reduce dielectric losses and allow three-dimensional stacking for full radiation coupling.
- LED Substrate with Ceramic Insulation Layer
A metal base supports a ceramic insulation layer and top conductor to lower thermal resistance while maintaining insulation reliability.
- Wiring Substrate Two-Layer Insulation Adhesion
A wiring substrate employs a segmented insulating layer with varying filler content to resolve adhesion strength versus dielectric loss trade-offs.
- Magnetic Dielectric Resin Composition for Copper Clad Laminates
A magnetic dielectric resin composition uses iron oxide and metal oxide fillers to achieve high relative magnetic permeability in copper clad laminates.
- Foam Core Dielectric Materials for RF Interconnects
Polymer foam cores bonded to conductive foil resolve weight and signal loss trade-offs in harsh environments.