Electrolytic Organic Material Coating TRIZ Cases
- Imidazole Plating Compound for Void-Free Copper Filling
A copper deposition composition uses imidazole compounds to achieve uniform metal layer filling.
- Electrodepositable Coating with Non-Solubilized Zinc for Low-Temperature Curing
Non-solubilized zinc compounds enable low-temperature curing in electrodepositable coating compositions.