Epoxynovolac Adhesives TRIZ Cases
- High temperature epoxy adhesive formulations
A bisphenol epoxy, novolac resin, polyurethane toughener, and latent accelerator improve thermal stress resistance to 140°C.
- One-Component Adhesive Compositions Using Heat-Activated Lewis Acid Catalyst
Heat-activated Lewis acid catalysts enable one-component adhesives to achieve high lap shear strength and resilience while maintaining storage stability.
- Epoxy Adhesive with Pyrazine Amine for Low-Temperature Curing
A curable composition using a urea accelerator and pyrazine amine to join epoxy resin at reduced temperatures.
- High Tg Epoxy Varnish for Pad Cratering Resistance
Varnish formulations using bisphenol-A novolac epoxy resins reduce pad cratering in printed circuit boards.
- Epoxide Adhesive Composition with Insoluble Imidazole Accelerator
A single-component adhesive composition uses an insoluble imidazole derivative to enable rapid hardening at 100°C.
- Thermally Expandable Adhesive Sheet with Permeable Layers
A thermally expandable adhesive sheet uses permeable layers to release tacky adhesive upon heating.