Filling Pastes TRIZ Cases
- UV-Curable Putty Composition for Low-Shrinkage Wood Repair
High-solids UV-curable putty uses dual photoinitiators, wax, and silica to improve cure, adhesion, and low-shrinkage filling on wood lines.
- Styrene-Free Reactive Resin Composition for Fast Drying and Flow
Thiol and amine accelerators replace styrene while improving curing, sandability, and flow in low-talc reactive resin formulations.
- Dry Film Composition With Bimodal Fillers for Low Porosity
A bimodal filler blend and siloxane hydrophobing agent create dense dry films with fewer pores, lower water absorption, and better fire resistance.
- Thermally Conductive Silicone Composition for Filler Precipitation Control
Controlled-viscosity silanol organopolysiloxane suppresses filler precipitation while preserving flexibility, thermal conduction, and storage stability.