Fine Working Devices TRIZ Cases
- Ferrite Layer Patterning for Precise Thick-Film RF Regions
Blade or laser cuts pattern thick ferrite layers with sharper edges, relieve lattice strain, and improve RF region definition.
- Pressure-Guided Wafer Spalling for Planar Crack Control
Applying pressure during thermal spalling guides crack propagation, reducing Wallner lines, kerf loss, and wafer surface roughness.