Fine Working Devices TRIZ Cases
- Dual-Width Saw Blade for Panel Level Package Cutting
Segmented saw blades with varying widths reduce one-sided wear on panel level packages, extending usage periods.
- Thermal Stress Cleaving Single Crystal Substrate
Bonding a high-expansion mandrel to a parent single crystal substrate enables thermal cleavage that eliminates saw blade kerf waste.
- Laser Chip Cutting via Intermediate Modified Regions
A laser processing method forms modified regions within silicon wafers to enable precise cutting along defined lines.
- Gemstone Feeding Machine with Parallel Conveyor Belts
Parallel conveyor belts automate sequential gemstone discharge, resolving throughput limits in space-constrained processing environments.
- SiC Wafer Separation Using Dual-Density Ultrasonic Vibration
Dual-density ultrasonic vibration breaks separation layers in silicon carbide ingots for precise wafer extraction.
- Scribing Wheel Recess Design for Panel Crack Prevention
Optimized recess geometry in a scribing wheel prevents stress concentration, eliminating cracks and side surface grinding for thin mobile panels.