Selective nanofiller localization in block-copolymer thermal pads boosts heat conduction while resisting cracks, voids, and delamination.
A dual-layer intumescent coating combines physical and gas-foaming agents to shrink expansion pores and slow heat transfer.
Expandable graphite and ceramic layers combine intumescent expansion with prolonged fire protection and structural integrity at high temperatures.
A phosphorus compound, maleimide, and allyl compound combine to improve flame retardancy, thermal resistance, and dimensional stability in PCB dielectrics.