Impedence Networks TRIZ Cases
- Vibration Device Metal Bump Stress Reduction
Metal bumps and a relay substrate support the vibrator, eliminating resin outgassing that degrades frequency characteristics.
- Hermetic Sealing via Groove Energy Beam Welding
Groove-based degassing eliminates unstable dimension management and extended times, stabilizing hermetic sealing quality.
- Acoustic Wave Device Protective Cover for Molding Compound Intrusion
Protective cover prevents molding compound intrusion into resonant area, enabling copper pillar reflow bonding without frequency response alteration.
- Translucent Alumina Ceramic Substrate for Flip Chip Alignment
A translucent alumina ceramic supporting substrate enables visual alignment of piezoelectric layers during flip chip bonding.
- Semiconductor Lamella Decoupling Region for Switching Loss Reduction
Segmented silicon dioxide lamellas lower permittivity in the substrate, reducing switching losses and improving capacitive readout sensitivity.