Inorganic Insulators TRIZ Cases
- Silsesquioxane Potting Composite for Low-Shrinkage Electronic Encapsulation
A filler-rich silanol composite cures into a strongly adherent, thermally stable potting material with reduced shrinkage for electronics.
- Silanol Composite Potting for Thermally Stable Power Electronics
A silanol-filled potting compound bonds to OH-bearing surfaces to improve heat transfer, adhesion, and thermal stability without pressure or vacuum.
- MI Cable Crack Detection via Metallurgical Jointing
Metallurgical joints replace adhesives to prevent environmental degradation and false breakage signals in crack detection systems.
- Dielectric Layer Resistivity via Carbon Nanotube Graphite Fillers
Carbon nanotube and graphite fillers tune dielectric layer resistivity, eliminating dopant migration and moisture dependence in electrophoretic displays.