Insulating Substrate Metal Adhesion Improvement TRIZ Cases
- Porous Resin Wiring Structure for Fine-Line Adhesion
Micropores formed in the resin surface anchor the seed layer, improving fine wiring adhesion while avoiding collapse, separation, and excess roughness.
- Ceramic Substrate Bonding With Matched Spacer for Faster Etching
Matched spacer properties and partial metal paste sintering cut etching time while improving ceramic substrate bonding reliability.
- Bonded Substrate Edge Geometry for Heat-Cycle Circuit Boards
A protruding peripheral bonding member and tapered metal plate edge improve heat-cycle reliability while preserving component mounting area.