Machining Working Media TRIZ Cases
- Electrochemical Cavity Machining with Distributed Electrolyte Channels
Distributed electrolyte channels around the electrode improve cavity alignment, flow uniformity, and byproduct removal in electrochemical machining.
- Supersaturated Film ECM for Nickel Superalloy Surface Uniformity
An organic electrolyte saturated with nickel chloride forms a supersaturated film during ECM, smoothing nickel superalloy micro-areas.
- NTA Electrolyte for Sludge-Free ECM of Nickel Superalloys
NTA-complexed NaNO3 electrolyte reduces sludge and hydrogen bubbles in ECM of γ-γ'' nickel superalloys, improving surface finish and yield.
- Gradient Metal Surface Structuring for Quantitative SERS Detection
Sequential metal removal creates gradient surface regions that simplify quantitative SERS detection without complex uniform nanostructure control.
- Electrochemical Discharge Micro-Grinding for Low-Damage Silicon Machining
Electrochemical discharge softens brittle silicon surfaces before grinding, reducing chipping and tool wear while preserving precision.
- ECM Electrolyte Composition for Nickel Superalloy Sludge Reduction
Complexing agents in NaNO3 electrolyte keep nickel superalloy machining products soluble, reducing sludge, bubbles, and surface roughness.
- ECM Electrolyte Composition for Homogeneous Nickel Superalloy Dissolution
A NaNO3-halide electrolyte with optional EDTA and surfactant improves homogeneous ECM of γ-γ′ nickel superalloys while reducing roughness and bubbles.
- ECM Electrolyte Composition for Uniform Nickel Superalloy Dissolution
A NaNO3-based ECM electrolyte with bromide additives and EDTA improves gamma-gamma prime superalloy dissolution, surface finish, and yield.
- Porous Mesh Plate Fabrication via Electrochemical Etching
Electrochemical etching creates uniform holes in porous mesh plates, resolving manufacturing cost and precision trade-offs.
- Wire EDM Fluid Level Control for Thermal Stability
A wire electric discharge machine adjusts working fluid levels to stabilize the workpiece environment during measurement operations.