Mechanical Vibrations Separation TRIZ Cases

This case combines phase-additive and DMAS beamforming, switching by spatial correlation to improve image quality without losing contrast.

Eccentric masses combine high-frequency torsion with lower-frequency vertical vibration to break soil friction and drive piles quietly.

A centering arrangement aligns an oscillator with an impulse transmission element in ultrasonic machining tools.

A piezoelectric thin-film element uses a perovskite metal oxide to achieve high resonance frequencies while suppressing dielectric loss in GHz bands.

A vibration absorbing layer absorbs mechanical energy from a piezoelectric thin film to reduce overlapping ultrasound cycles, resolving low vertical resolution.

Voltage divider applies pre-heating voltage during non-puff periods to maintain low viscosity, ensuring quick atomization when user puffs.

Nodal mounting points on rigid boosters contain vibrational energy, reducing power requirements and improving weld quality.

A thin-film acoustic imaging system uses adhesive bonding to couple piezoelectric transducers directly to sensing plates.

A haptic actuator uses magnetic bodies moving along an arcuate path to generate multi-directional tactile feedback.

A multi-tactile feedback component integrates thin film deformation and vibration elements for realistic haptic output.

Front-side membrane insertion eliminates complex decoupling rings and reduces manufacturing costs.

Non-radiative acoustic lubrication enables distinct texture sensations for each finger, resolving the limitation where all fingers experience identical stimuli.