Suspension polymerization forms hollow particles with high void ratio, lower solvent residue, and better collapse resistance during molding.
Monomer displacement enables hollow COF particles with controlled size, wall thickness, and surface area for catalysis, separation, storage, and drug release.
Dispersed raspberry nanoparticles stay below 130 nm to avoid aggregation and enable single-step superhydrophobic or superhydrophilic coatings.
Heat-drying hollow resin precursor particles near their decomposition limit removes trapped hydrocarbon solvent while suppressing breakage.
Bulk emulsification with surfactant-stabilized magnetic hydrogel particles enables uniform reaction droplets without complex microfluidics.
Surface-reactive, crosslinked hollow particles keep high void ratio while improving pressure resistance and resin adhesion in molded bodies.
Crosslinked hollow particle shells resist acetone and prevent collapse, enabling lighter fiber-reinforced molded bodies with stable voids.
Electropolished feeding surfaces plus higher tip speed and temperature cut black spots and prevent clogging during microsphere pre-expansion.
Controlled PEGylated phospholipid and ligand ratios keep gas-filled microvesicles stable, enabling buoyancy-based cell separation without aggregation.
A tuned solvent SP range enables phase separation and solvent removal to form large hollow perfluororesin particles with a monoporous structure.