Porous materials inside the rear cavity reduce Q-factor and excursion, improving frequency response without increasing device size.
A dielectric liquid and inert gas fill the hydrophone housing to prevent freezing and reduce thermal noise.
An electrostatic loudspeaker embeds the driving circuit inside the back chamber, solving miniaturization challenges while maintaining high-frequency response.
Merging the acoustic path into the data interface jack eliminates separate casing holes, reducing manufacturing complexity and improving device aesthetics.
Segmenting the port into distinct cavities with local quality materials prevents acoustic leakage and light interference in thin devices.
A universal microphone unit encrypts voice signals before transmission to existing radios.
Tuned vibration unit amplifies bone conduction signals in the 800-8000 Hz range, resolving low sensitivity and poor voice quality.
A shielded microphone assembly uses a resilient separator to manage stacking tolerances and establish electrical grounding.