Microstructural Devices TRIZ Cases
- MEMS Dynamic Parameter Extraction from Static Excitation
Static excitation and model-based evaluation derive MEMS resonance and damping accurately without high-frequency testing or long measurements.
- MEMS Structure Deflection for Non-Destructive Under-Etch Testing
Applying perpendicular mechanical force measures structural deflection to determine under-etched distance without destructive sample preparation.
- Micro-assembler Backplane With Independent Trap Locations
Separate trap locations on the backplane hold micro-objects without continuous electrode activation, reducing energy consumption and system complexity.
- Micromirror Sensor Interconnection for Natural Frequency Recognition
Interconnected sensor units generate an overall signal that amplifies the first vibration mode of a micromirror.
- Out-of-Plane IR Illumination Module for Compact Eye Tracking
An infrared illumination module redirects light out of plane to reduce the z-dimensional profile.
- Transfer Head Array Shielding Layer for Electrostatic Interference
A conductive shielding layer embedded in the interlayer isolation of a transfer head array blocks external electric fields.
- MEMS Device Isolation via Segmented Base Cavities
Segmented base cavities isolate the MEMS sensor from thermal expansion strain, preventing structural deformation and enhancing device reliability.