Non-Surface-Active Detergent Solvents TRIZ Cases
- Wafer Meniscus Vapor Drying to Reduce CMP Residue Defects
A mixed solvent-cleaner-inert gas vapor over the wafer meniscus cuts CMP residue reattachment, streaking, and spotting during drying.
A mixed solvent-cleaner-inert gas vapor over the wafer meniscus cuts CMP residue reattachment, streaking, and spotting during drying.