Polishing Machines TRIZ Cases

Solid polishing agents remove oxide films and defects from the stainless steel pipe surface, preventing early-stage rusting in waterfront environments.

Dual linear oscillation of the pressure roll improves surface roughness and precision without increasing mechanism complexity.

A polarity-changed electrode adsorbs silica or ceria particles from the slurry, preventing wafer scratches and yield loss.

A polishing pad with raised fibers deforms to reach inner surfaces of recessed portions, resolving incomplete polishing near projections.

Real-time sensor feedback replaces dummy wafer conditioning, cutting process time and cross-contamination risks.

A rotary mill uses segmented ceramic media to increase fly ash surface area for cement replacement.

Segmented loading and unloading grilles retain grinding bodies, enabling higher filling levels while preventing accidental escape through openings.

A grinding pad deformation device uses offset units and independent members to adjust angles.

Chemical etching removes deep scratches from glass screens while the cured resin provides scratch and chemical resistance.

Side transfer devices reduce load on top transfer units by routing wafers through shared channels, ensuring stable transport across multiple polishing stations.

An annular spacer contacts hole walls to counteract centrifugal run-out, enabling precise polishing of deep workpiece cavities.

Liquid-filled grinding chamber maintains constant temperature while oscillating tool adjusts belt roughness, correcting Hunter gloss and smoothness defects.

A gravity-actuated fixture moves an airfoil root into contact with a rotating brush, resolving ergonomic risks and operator inconsistency in manual polishing.

A segmented polishing head assembly with independent rotating units and air springs applies uniform pressure to float glass surfaces.

Segmented polishing pads divide a large surface into independent zones, resolving uniformity issues across small unit areas while maintaining high efficiency.

A segmentation type head module locally pressurizes semiconductor substrates via independent fluid lines to control polishing pressure.

Decoupling elements reduce friction between the working disk and support disk, minimizing thermal expansion geometry changes in double-side machine tools.

Weighted regression of spectral data creates accurate thickness maps, reducing non-uniformity and improving endpoint detection reliability.

Composite brushes with embedded diamond particles increase floor slip resistance without damaging surface shine.

Microporous polymeric foam polishing pad with controlled pore structure.

Grooved platen channels vent trapped air to ambient space, preventing fluid intrusion and non-uniformities.

A rock polishing system uses a movable fence to constrain the stone and prevent groove formation during rotation.

Liquid honing generates compressive residual stress on smoothed gear teeth to resolve fatigue strength limits without adding manufacturing steps.

A substrate cleaning device polishes the back surface of a rotating wafer using a movable polishing head to remove adhered contaminants.

Automated CMP pad replacement system removes used pads and applies new ones via a tape module, reducing production downtime.

A nonwoven abrasive wheel integrates superabrasive particles into a polyurethane binder for precise surface finishing.

Asymmetric bristles stabilize rotation, reducing radial movement and thermal damage to heat-sensitive dental materials.

A curved abrasive tool polishes asymmetrical crystal blanks via a moving support, eliminating damage from rigid grinding wheels.

A control apparatus deforms a processing disk to optimize the working gap width for flat workpiece machining.

A substrate cleaning device coordinates two cleaners moving along intersecting paths to prevent mechanical interference during rotation.

An optically transmissive planarizing pad window enables continuous surface monitoring during rotation.

A rotary striking member with protruding portions impacts surfaces to create dot-shaped concaves and convexes.

Fiber optic contact sensor embedded in planarizing pads detects mechanical and acoustic energy during chemical-mechanical polishing.

Dual pulley system accelerates bristle tips via inertial forces, eliminating stop elements to reduce vibration and noise during surface processing.

Softening solid pastes enables continuous automated conveyance through pump units, reducing material waste and eliminating frequent rod replacements.

Knitted sheep wool loops on a backing layer prevent fiber entanglement and ensure consistent polishing quality despite natural wool variations.

An oscillating brush holder enables multi-directional movement to prevent tool-induced effects and ensure uniform wear across rock surfaces.

A texturing slurry containing diamond clusters with controlled impurities and dispersants forms precise marks on magnetic hard disk substrates.

A CMP dresser measures pad height across zones to maintain cutting rate.

A boot-shaped rubber film polishing head applies uniform pressure to secure wafers during chemical mechanical planarization.

A CMP pad with a three-dimensional network of interconnected unit cells reduces defect formation by decoupling contact mechanics from fluid mechanics.

A rotary brush unit uses a single stopping means to brake bristles and reground tips via rotation direction.

Soft porous rollers cushion metallic-glass particles to reduce copper foil roughness without scratching or breaking the material.

Rubber V-ring seal ring maintains differential pressure between concentric chambers to ensure uniform wafer polishing.

An electrorheological polishing apparatus manipulates fluid viscosity via high-voltage fields for precise intraocular lens finishing.

Obtuse and acute groove angles reverse slurry flow against rotation, reducing consumption while maintaining consistent contact area.

Eccentric rotation pressurizes water flowing through center holes to wash away sanding dust and prevent clogging.