Separate lowering and pressurizing mechanisms simplify ultrasonic welding control, cut detection steps, and maintain accurate contact force.
A downstream secondary jet nozzle adds molten solder after the primary wave to improve through-hole wetting and prevent unsoldered joints.
A soft-solder matrix with enclosed high-melting particles forms a pore-free intermetallic joint above 400°C without pressing or heat treatment.
A copper-based active brazing composition uses reactive metals to bond ceramics reliably while cutting silver cost and avoiding migration.
A touch electrode wrapped around the microphone hole expands earbud touch area, improving sensitivity without adding extra components.