Printed Element Electric Connection Formation TRIZ Cases
- Copper Pillar Sintering with Pressure Plate to Prevent Adhesion
A pressure-assisted sinter unit uses an intermediary plate to fully densify copper pillars while preventing adhesion and material loss.
- Tin Alloy Plating Composition for Uniform Films Without Leveler Degradation
A C9-C18 alkane sulfonic acid and phenyl nonionic surfactant smooth tin alloy plating while avoiding electrolysis-driven leveler degradation.