A 3D braided composite structure resolves delamination risks by interlacing fibers in three dimensions, enhancing perpendicular strength and impact resistance.
Composite polyester base and release layer suppress wrinkle formation by limiting dimensional change, ensuring stable releasability in semiconductor sealing.
A form-shapable tarpaulin incorporates a malleable component to retain manual shaping and prevent water pooling.
A composite sheet uses unidirectionally aligned HPPE fibers with a specific polymeric resin to enhance delamination resistance.