Radiation Applications TRIZ Cases
- Hypervalent Iodine Resist Composition for EUV Lithography
A hypervalent iodine compound and carboxy polymer form a non-amplified resist film for high-energy radiation patterning.
- Negative Photoresist Composition for Thick Film Imaging
A light-sensitive negative photoresist composition enables single-step imaging of thick films up to 200 µm with vertical sidewalls.
- Charged Particle Beam Patterning for OLED Conductive Polymer Layers
Charged particle beams pattern conductive polymer layers via shadow masks, eliminating wave guiding effects and contamination while lowering power consumption.
- Organometallic Resist Composition for Low-Dose Lithography
An organometallic resist composition changes solubility directly upon light exposure to enable high-resolution patterning.
- Photosensitive Resin Composition for High-Resolution Thin Film Patterns
A photosensitive resin composition forms high-resolution cured film patterns using specific photopolymerization initiators.
- Photo-curing Metallic Inks via Copper Nanocluster Phase Control
Photonic curing of metallic inks uses copper nanocluster phase transitions to achieve low resistivity.