Semiconductor Electrostatic Transducers TRIZ Cases
- MEMS Transducer Membrane Anchoring Structure for Noise Reduction
Segmenting the membrane anchoring structure into discrete points reduces turbulent air flow noise while maintaining manufacturing simplicity.
- MEMS Transducer Package with Integrated Die and Wafer-Level Cap
Integrating electronic circuitry within the semiconductor die eliminates multi-part assembly complexity while maintaining environmental protection.
- MEMS Microphone Plate with Corrugations and Anti-Stiction Coating
Corrugations in the epitaxial silicon plate resist residual stress and stiction, increasing signal-to-noise ratio for MEMS microphones.
- MEMS Sensor Lead Frame Recess for Signal-to-Noise Optimization
A MEMS sensor structure uses a lead frame recess to form an acoustic chamber that enhances signal quality.
- Integrated MEMS Microphone Circuitry Protection
A suspended diaphragm microphone integrates detection circuitry on a single die using compatible deposition materials.
- Microphone Lid With Offset Port And Insert
An insert links the transducer front volume to an offset lid opening, decoupling thermal stress and preventing dust deposition on the membrane.