Junction capacitor resonance frequency shifts with thermal changes, solving variable contact issues in semiconductor processing.
Measurement circuitry detects degraded RTD connections and switches wire configurations to maintain accurate temperature readings.
Calculating an intercept frequency from two impedance measurements reduces noise interference and improves measurement efficiency.
A heat spreader couples to a mobile thermal sensor substrate to dissipate internal heat evenly across thermopile components.
Double integration captures thermal patterns by calculating differences between readings from heating and cooling phases, reducing stray noise.
Lateral nanowire sensors use segmented junctions to detect chemical reactions via resistance changes.
A calibratable semiconductor diode on a shared substrate detects integrated circuit temperature using stored linear characteristics.