Skin layers with specific thickness compensate for core layer temperature sensitivity, stabilizing acoustic velocity and minimizing transmission loss.
A radar circuit package mounts the circuit on a dielectric cover to enable effective radiation of millimeter-wave signals.
Band-limited masking signal combines with service data to prevent on-board devices from connecting to terrestrial base stations.
A light sensing module uses a distance increasing layer and converging elements to direct reflected light onto photodiode arrays.
Two-stage compressive sensing reduces sensor array weight and processing time while maintaining damage detection accuracy in large structures.
Separating phase shifters onto a distinct integrated circuit resolves emitter density limits in two-dimensional optical phased arrays.
A 90° hybrid coupler isolates RF signals to enable robust RX monitoring without signal attenuation or dedicated switches.
Ultrasound imaging system derives depth from user-selected regions to automate parameter adjustment, resolving iterative tuning complexity.
An ultrasonic lens transfers acoustic power from an electrodynamic transducer to parallel sound ports.
A package-on-package proximity sensor module uses an IR cut mold compound to minimize optical cross-talk between stacked infrared components.