Welding/Cutting Media/Materials TRIZ Cases
- Active Brazing of AgC Contacts to Cu Carriers Without Backing Layers
Active braze alloys form carbides with graphite, enabling direct AgC-to-Cu joining with stronger bonds and simpler manufacturing.
- Solar Cell Electrode Paste for Low-Temperature Wiring Attachment
A metal-solder-adhesive electrode paste enables low-temperature wiring attachment with lower resistance, stronger adhesion, and less cell damage.
- Au-Sn Solder Ball Junction Structure for Thin Reliable Joints
Au-Sn solder balls form uniform 3-50 μm eutectic joints that avoid flux-related defects, cut Au usage, and improve thermal conductivity.