1U Server Memory Module Assembly for High-Capacity Thermal Control
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Solution Overview
Problem
Existing memory modules face thermal challenges and require additional access pins when stacking memory chips, limiting memory capacity without increasing the physical footprint in server racks.
Innovation Solution
A server memory device comprising two memory modules bonded with interposers and a connector, allowing for high-density interconnects that double the memory ranks while occupying the same physical space as a single DIMM, using gold fingers on the connector and contacts on the modules and interposers for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory chips are stacked to increase capacity, then memory capacity is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent transitions from vertical stacking (3D stacking) to horizontal arrangement of memory modules within a single rack unit. By utilizing the horizontal plane and bonding multiple memory modules side-by-side on a single dual-inline memory module (DIMM) carrier, the design achieves high capacity without the thermal accumulation problems of vertical stacking.
Solution Approach 2:
The patent divides the memory system into multiple separate memory modules bonded on a single DIMM, rather than stacking chips vertically. Each memory module operates independently with its own thermal profile, allowing for better heat dissipation and management compared to tightly stacked memory chips.
2Quantity of substance
If multiple memory modules are used to increase capacity, then memory capacity is improved, but the physical footprint in server racks increases
Solution Approach 1:
The patent merges multiple memory modules onto a single DIMM carrier, combining their capacities while maintaining a single physical footprint in the server rack. This allows two or more memory modules to occupy the space of one standard DIMM slot, doubling or tripling capacity without requiring additional rack units.
Solution Approach 2:
The patent nests multiple memory modules within a single DIMM structure, similar to nested dolls. The memory modules are bonded together on the DIMM carrier, creating a compact assembly that fits within the standard DIMM form factor, thereby maximizing space utilization in server racks.
3Quantity of substance
If memory modules occupy multiple rack units, then memory capacity is improved, but device complexity increases
Solution Approach 1:
The patent creates a universal memory module assembly that fits into a single standard DIMM slot while providing the capacity of multiple modules. This multi-functional design allows the same physical interface and rack unit to deliver enhanced capacity, simplifying system configuration and reducing the complexity of rack management.
Data Source
AI summary
A server memory device provides highspeed storage to a computer system. The server memory device has a connector that can make electrical coupling with the computer system. The server memory device includes two memory modules, each with one or more memory chips. Each memory module is coupled and bonded with an interposer. Each interposer is coupled and bonded with the server memory device connector. The connector and interposers provide a high-density interconnect that connects two memory modules to a computer system. The server memory device has a form factor that uses a single unit (1 U) of a server rack, doubling the memory capacity provided to the computer system through a single unit (1 U) equipment rack.