2.5D Memory Interface Architecture for Multi-Protocol Scaling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 2.5D interface architectures are limited in scalability, capable of interfacing only with a single 2.5D device and are not adaptable to various emerging memory standards, such as Quad Data Rate Wide Input Output (QDR WIO) SRAM and High-Bandwidth Memory (HBM) DRAM, due to rigid partitioning and proprietary protocols, which restricts the choice of compatible memory devices and limits frequency operation.
Innovation Solution
A scalable 2.5D interface architecture is developed, featuring a modular organization with 48-IO modules and a mid-stack module, utilizing programmable logic to support multiple protocols and enable interfacing with various memory devices through a silicon interposer or bridge, allowing for flexible configuration and operation across different clock domains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If synchronous DDR signaling is used to interface with proprietary SRAM memory dice, then the interface can achieve stable communication, but the maximum operating frequency is limited to around 500 MHz due to interconnect propagation latency
Solution Approach 1:
The patent transitions from synchronous DDR signaling to asynchronous signaling, allowing the interface to dynamically adapt to varying propagation delays without being constrained by a fixed clock cycle. This enables operation at higher frequencies while maintaining communication reliability through handshaking protocols rather than rigid timing synchronization.
Solution Approach 2:
The interface architecture changes the signaling parameter from synchronous (clock-driven) to asynchronous (event-driven), fundamentally altering how timing and data transfer are managed. This parameter change removes the frequency ceiling imposed by synchronous timing constraints while preserving data integrity through protocol-level error checking and acknowledgment mechanisms.
2Reliability
If the interface architecture is designed for proprietary 2.5D interface protocols, then it can interface with specific memory devices, but it cannot scale to support multiple emerging memory standards such as QDR WIO SRAM and HBM DRAM
Solution Approach 1:
The patent designs a universal interface architecture that can operate with multiple memory standards (QDR WIO SRAM, HBM DRAM, and proprietary protocols) through a common hardware platform. The asynchronous signaling and partitioned buffer architecture provide a standardized interface layer that adapts to different protocol requirements without requiring proprietary custom designs for each memory type, thereby achieving both reliability and scalability.
Solution Approach 2:
The interface is segmented into independent functional blocks including separate input/output buffers, command modules, and data modules that can be independently configured for different protocol requirements. This modular segmentation allows the same physical interface to be reconfigured for different memory standards while maintaining stable communication through protocol-specific control logic.
3Device complexity
If the 2.5D interface architecture uses rigid partitioning for proprietary protocols, then the hardware structure is simplified, but the same ASIC/ASSP silicon cannot interface with different memory devices requiring different protocols
Solution Approach 1:
The patent introduces dynamic configurability to the interface architecture, allowing the same hardware structure to adapt its behavior and timing characteristics for different memory protocols. The asynchronous signaling and programmable buffer configurations enable the interface to dynamically adjust to QDR WIO, HBM, or proprietary protocols without requiring separate dedicated hardware for each standard, thus maintaining simplicity while achieving versatility.
Data Source
AI summary
Systems and methods for interface block. The interface block includes input/output modules distributed along the interface block and a mid-stack module interspersed within the input/output modules. The input/output modules include at least one data module and at least one command module. At least one of the input/output modules is shared by an adjacent pair of channels. Each of the input/output modules is configured to interface with a memory device via a silicon interposer or equivalent. The mid-stack module is in communication with the input/output modules via programmable logic circuitry. The mid-stack module may include independent clock quadrants. Each clock quadrant is configured to operate at different phases where each phase is aligned to a respective core clock.