2.5D Optoelectronic Packaging Structure for Mixed-Node Chip Integration
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Solution Overview
Problem
Existing optoelectronic integrated packaging structures fail to meet high-density integration requirements due to the mismatch in process dimensions between silicon photonics and electronic chips, leading to performance bottlenecks and increased packaging costs.
Innovation Solution
Implement a 2.5D integrated packaging method that includes forming a silicon substrate with redistribution layers, metal pillars, and through-holes to connect photonic and electronic chips, using Flip-Chip bonding and encapsulation, enabling high-density integration of chips with different process nodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon photonics and electronic chips are directly bonded on the same substrate, then the packaging structure can be formed, but the integration density is insufficient due to process dimension mismatch
Solution Approach 1:
The patent introduces intermediate redistribution layers and metal pillars to create a multi-dimensional interconnection architecture. The first redistribution layer is formed on the substrate, followed by vertical metal pillars that extend upward, and then a second redistribution layer is formed at a higher elevation. This three-dimensional stacking approach allows photonic and electronic chips with different process nodes to be interconnected without requiring direct planar alignment, thereby achieving high integration density despite process dimension mismatches.
Solution Approach 2:
The patent employs redistribution layers and metal pillars as intermediary structures between photonic and electronic chips. These intermediaries serve as buffer zones that can accommodate different process dimensions, enabling chips with mismatched geometries to be interconnected. The redistribution layers act as adaptive interfaces that can be independently optimized for each chip type, resolving the dimensionality conflict.
2Manufacturing precision
If system-on-chip packaging is used to improve integration density, then packaging density increases, but front-channel process modification on optical chip increases packaging cost
Solution Approach 1:
The patent divides the interconnection structure into separate modular components: substrate-level redistribution layers, vertical metal pillars, and chip-level bonding interfaces. This segmentation allows each component to be independently optimized and manufactured using existing processes, avoiding the need for expensive front-channel modifications to optical chips while achieving high packaging density through systematic integration.
3Manufacturing precision
If wire-bonds or Flip-Chip techniques are used for electrical connection, then electrical connectivity is achieved, but the line width and spacing cannot meet high-density requirements
Solution Approach 1:
The patent transitions from planar wire-bonding to vertical Flip-Chip connections with metal pillars extending in the Z-direction. This dimensional transition enables much smaller lateral footprints for connections, achieving sub-10-micron line widths and spacing that are incompatible with traditional wire-bonding but readily achievable through vertical interconnect structures.
Data Source
AI summary
A method for preparing an optoelectronic integrated semiconductor packaging structure that employs 2.5D integrated packaging. Both photonic and electronic integrated chips at different sizes are flip-chip mounted within the same packaging structure. This approach allows for the co-packaging of photonic and electronic integrated chips, effectively reducing the line width and spacing of the packaging structure. It enables high-density integration and packaging of chips from different size with varying process nodes through back-end processes.