2D Coil Emulating 3D Eddy Current Sensor Response
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Solution Overview
Problem
Current non-destructive testing technologies using eddy current (EC) sensors face challenges in sensitivity to conductivity and permeability changes, and are limited by bulky 3D coil configurations that are labor-intensive and costly to fabricate, while 2D printed circuit board (PCB) technologies are restricted to 2D coil configurations that cannot emulate 3D EC sensor structures effectively.
Innovation Solution
A method to emulate the EC response of a 3D EC sensor using a 2D coil configuration suitable for PCB fabrication, allowing for the creation of thin, flexible, and cost-effective 2D EC sensors that replicate the defect signatures of their 3D counterparts, enabling access to tight spaces and higher resolution scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If 3D coil configurations are used for EC sensing, then sensitivity to defects is improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent creates a 2D copy of the 3D coil configuration that replicates the essential electromagnetic sensing characteristics. The 2D coil array is designed to emulate the defect detection capabilities of complex 3D coils while being manufacturable using standard PCB technologies, thus reducing manufacturing complexity while maintaining measurement precision for defect detection
Solution Approach 2:
The patent replaces the mechanical winding process required for 3D coils with a planar PCB fabrication process. By substituting the mechanical coil-winding system with an electronically controlled 2D coil array on a PCB, the system achieves comparable sensing performance with significantly reduced manufacturing complexity and automated production capability
2Measurement precision
If 3D coil configurations are used for EC sensing, then defect detection capability is improved, but manufacturing cost and labor intensity increase
Solution Approach 1:
The patent creates a 2D copy of the 3D coil configuration that replicates the essential electromagnetic sensing characteristics. The 2D coil array is designed to emulate the defect detection capabilities of complex 3D coils while being manufacturable using standard PCB technologies, thus reducing manufacturing complexity while maintaining measurement precision for defect detection
Solution Approach 2:
The patent changes the geometric parameters of the coil configuration from three-dimensional to two-dimensional. By transforming the spatial arrangement of conductors into a planar layout with optimized trace patterns, the system maintains electromagnetic sensing effectiveness while enabling automated PCB fabrication processes, significantly improving ease of manufacture and reducing labor intensity
3Ease of manufacture
If 2D PCB coil configurations are used, then manufacturing cost is reduced and automated fabrication is enabled, but ability to emulate 3D EC sensor structures is limited
Solution Approach 1:
The patent uses multiple PCB layers to create a three-dimensional electromagnetic field structure from two-dimensional planar traces. By utilizing vertical stacking of conductive layers with appropriate spacing and positioning, the system emulates the 3D coil structure's electromagnetic characteristics while maintaining the manufacturing advantages of PCB technology
Solution Approach 2:
The patent changes the geometric parameters of the coil configuration from three-dimensional to two-dimensional. By transforming the spatial arrangement of conductors into a planar layout with optimized trace patterns, the system maintains electromagnetic sensing effectiveness while enabling automated PCB fabrication processes, significantly improving ease of manufacture and reducing labor intensity
4Reliability
If differentially connected coils are used to reduce sensitivity to conductivity and permeability changes, then insensitivity to material property variations is improved, but sensitivity to defects common to both coils is reduced
Solution Approach 1:
The patent applies local quality by creating regions of different coil orientations and configurations within the same sensor array. Certain areas use differential connections for insensitivity to material variations, while other regions use single-coil configurations for maximum defect sensitivity, allowing the system to optimize performance for different inspection requirements across the scanned surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 2D EC sensors achieve similar impedance plane defect signatures to 3D sensors, reducing manufacturing costs, enabling automated fabrication, and providing superior signal strength and flexibility, while allowing for multi-layer configurations for enhanced scanning capabilities.
Implementation Method 1
field producing means such as a coil connected to an AC source to generate EC's in a part
Implementation Method 2
EC inspection is commonly used in NDT/NDI applications to detect flaws in surfaces of manufactured components fabricated out of conductive materials
Data Source
AI summary
The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The 3D orthogonal sensor is conventionally wound onto a 3D core, with at least some of the surfaces being un-parallel to the surface be inspected. Using the herein disclosed 2D configuration allows the use of printed circuit board technologies for the manufacturing of these EC sensors. The herein disclosed method and the associated 2D EC sensors are particularly useful for reproducing the EC effect of conventional orthogonal probe arrays.