2D Single Crystal Stack Assembly With Controlled Interlayer Rotation

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Solution Overview

Problem

Existing methods for preparing two-dimensional material stacked structures face challenges in controlling the interlayer rotation angle, leading to complex operations, low yields, and exposure to external environments, making it difficult to achieve large-scale, clean, and specific-rotation angle two-dimensional single crystal stacks.

Innovation Solution

A method involving stacking single crystal substrates, rotating them to a specific angle, epitaxially growing two-dimensional single crystal materials, attaching the layers, and removing one substrate to obtain a large-scale two-dimensional single crystal stack with a controlled interlayer rotation angle.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If transfer or folding operations are used to control rotation angle after material growth, then rotation angle control is achieved, but the process becomes complex with low yield and harsh conditions

Engineering Contradiction:
Improverotation angle controlVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate stack is pre-assembled with the desired rotation angle before the two-dimensional material growth process. This preliminary configuration of the substrate stack eliminates the need for subsequent complex transfer or folding operations to achieve the target rotation angle, thereby simplifying the overall process while maintaining precise rotation angle control

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The single crystal substrate stack serves as an intermediary carrier that temporarily holds the two-dimensional materials in the desired stacked configuration with precise rotation angles. After the materials are grown and the substrates are removed, the rotation angle control is preserved in the final two-dimensional material stack without requiring complex post-processing operations

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If transfer or folding operations are used to control rotation angle after material growth, then rotation angle control is achieved, but material surface is exposed to external environment causing contamination

Engineering Contradiction:
Improverotation angle controlVSAvoidsurface contamination
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The entire process of substrate stacking, material growth, and intermediate handling is conducted within a controlled inert atmosphere (vacuum or gas environment). This protects the material surfaces from external environment exposure during the critical growth and configuration phases, preventing contamination while maintaining the desired rotation angle control

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The single crystal substrate stack acts as a protected intermediary structure that encapsulates the two-dimensional materials during the growth process. The substrates provide a clean, controlled environment that prevents direct exposure of the material surfaces to the external environment, thereby reducing contamination risks

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If direct growth of stacked structures is used, then clean two-dimensional stacked structures are obtained, but it is extremely challenging to grow large-scale, specific-rotation angle stacks with controllable rotation angle

Engineering Contradiction:
Improvesurface cleanlinessVSAvoidrotation angle control
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The substrate stack is pre-assembled with the desired rotation angle configuration before the two-dimensional material growth process begins. This preliminary arrangement of substrates with precise rotation angles allows the grown materials to inherit the desired rotational configuration, achieving both clean surfaces and precise rotation angle control in a single direct growth process

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The rotation angle control is achieved by changing the geometric configuration parameter of the substrate stack assembly. By adjusting the relative orientation and rotation angles of the substrate layers during assembly, the final two-dimensional material stack inherits these angular parameters, enabling precise control over the interlayer rotation angle while maintaining direct growth benefits

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the growth process, reduces contamination, and enables the direct preparation of high-quality, large-scale two-dimensional single crystal stacks with a specific rotation angle, suitable for industrial applications.

Implementation Method 1

the second single crystal substrate is rotated by a certain angle α relative to the first single crystal substrate so that the first crystal orientation of the first single crystal substrate and the second crystal orientation of the second single crystal substrate have an interlayer rotation angle α

Methodology Applied
Scientific EffectRotation:

Implementation Method 2

epitaxially growing two-dimensional single crystal materials on their surfaces

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS12612712B2Method for preparing large-scale two-dimensional single crystal stack having interlayer rotation angle
Publication Date: 2026.04.28 PEKING UNIV
  • US12612712B2 patent drawing
  • US12612712B2 patent drawing

AI summary

A method for preparing a large-scale two-dimensional single crystal material stack which has an interlayer rotation angle. Single crystal substrates are stacked and rotated at a specific angle, a two-dimensional single crystal material is epitaxial on the surface thereof, and then an upper layer and a lower layer of the two-dimensional single crystal material are attached, and a layer of the single crystal substrates on the surface is removed so as to obtain a two-dimensional single crystal stack which has a specific rotation angle. A large-scale two-dimensional single crystal material stack which has an interlayer rotation angle prepared by the described method.