2D Material Thin Film Layer Analysis via Hyperspectral Imaging
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Solution Overview
Problem
Current methods for analyzing 2D material thin films, such as AFM, Micro-RAMAN Spectrometer, SEM, and Multiphoton Laser Scanning Microscopy, are limited in their ability to efficiently and accurately determine the number of layers over large areas, with issues like limited scanning range, low thickness dependence, and complex sample preparation.
Innovation Solution
A method and system utilizing an optical microscope, Raman spectrometer, and a processor to capture and analyze visible light hyperspectral images, employing machine learning and deep learning algorithms to establish a thin film prediction model for accurate layer distribution analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If AFM is used to analyze 2D material thin films, then measurement precision is improved, but productivity deteriorates due to limited scanning range and time-consuming process
Solution Approach 1:
The patent combines optical microscopy with Raman spectroscopy to create a hybrid analysis system. The optical microscope provides rapid large-area scanning capability while the Raman spectrometer delivers precise layer thickness measurement. By merging these two techniques, the system achieves both high productivity from the optical component and high measurement precision from the Raman component, resolving the contradiction between speed and accuracy.
Solution Approach 2:
The patent introduces an intermediary processing system that captures optical images at multiple focal depths and uses image processing algorithms to determine layer thickness. This intermediary approach translates the rapid optical scanning capability into quantitative layer information, enabling fast analysis without sacrificing measurement precision that would otherwise require slow AFM scanning.
2Measurement precision
If Micro-RAMAN Spectrometer is used to analyze 2D material thin films, then measurement precision is improved, but productivity deteriorates due to low thickness dependence
Solution Approach 1:
The patent merges optical microscopy with Raman spectroscopy in a single integrated system. The optical microscope rapidly scans large areas to locate and characterize multiple regions, while the Raman spectrometer provides precise layer thickness measurement at selected points. This combination maintains the high measurement precision of Raman spectroscopy while dramatically improving productivity through the rapid optical screening capability.
Solution Approach 2:
The patent performs preliminary optical imaging and screening before conducting Raman measurements. The optical microscope first identifies regions of interest and pre-characterizes the sample layout, allowing the Raman spectrometer to focus only on critical areas. This preliminary action reduces the number of time-consuming Raman measurements needed while maintaining accurate layer determination.
3Productivity
If SEM is used to analyze 2D material thin films, then productivity is improved through fast screening, but measurement precision deteriorates due to inability to accurately determine layer number
Solution Approach 1:
The patent combines the fast imaging capability of SEM with the precise layer measurement capability of Raman spectroscopy. The SEM provides rapid overview and structural context with high productivity, while the Raman spectrometer delivers accurate layer thickness measurement. By merging these techniques, the system maintains the screening speed of SEM while overcoming its limitation in precise layer determination.
Solution Approach 2:
The patent uses optical microscopy as an intermediary between SEM screening and Raman measurement. The optical microscope provides a bridge that maintains sample integrity and enables non-contact, rapid imaging with depth discrimination capability. This intermediary allows fast screening similar to SEM while preserving the ability to perform accurate layer measurements without the harsh sample preparation requirements of SEM.
4Measurement precision
If TEM is used to analyze 2D material thin films, then measurement precision is improved, but device complexity increases due to complicated sample preparation process
Solution Approach 1:
The patent replaces the complex mechanical sample preparation and thinning processes of TEM with a non-contact optical measurement system. Instead of mechanically preparing ultra-thin samples for TEM, the system uses optical microscopy to image through the substrate and Raman spectroscopy to measure layer thickness. This substitution eliminates the complex sample preparation workflow while maintaining the ability to achieve precise layer determination.
Solution Approach 2:
The patent introduces optical microscopy as an intermediary that enables non-invasive imaging and measurement through the substrate. This intermediary approach allows the system to obtain layer information without the complex sample preparation required by TEM, simplifying the overall process while maintaining measurement precision through the combination of optical imaging and Raman spectroscopy.
Data Source
AI summary
A method for analyzing 2D material thin film and a system for analyzing 2D material thin film are disclosed. The detection method includes the following steps: capturing sample images of 2D material thin films; measuring the 2D material thin films by a Raman spectrometer; performing a visible light hyperspectral algorithm on the sample images by a processor to generate a plurality of visible light hyperspectral images; performing a training and validation procedure, performing an image feature algorithm on the visible light hyperspectral images, and establishing a thin film prediction model based on a validation; and capturing a thin-film image to be measured by the optical microscope, performing the visible light hyperspectral algorithm, and then generating a distribution result of the thin-film image to be measured according to an analysis of the thin film prediction model.