Two-Dimensional Material Patterning on Flexible Substrates
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Solution Overview
Problem
Existing methods face challenges in creating desired micro- or nano-patterns of two-dimensional materials like graphene on flexible substrates due to material characteristics, leading to surface instability and low yield in patterning processes.
Innovation Solution
A method involving forming a two-dimensional material layer on a substrate, patterning using photolithography or e-beam lithography, coating a flexible substrate solution, curing, and removing the substrate using ammonium persulfate or strong acids, allowing for the formation of micro- or nano-patterns on flexible substrates like polyimide or polycarbonate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lithography process is used on flexible substrate after transferring two-dimensional material, then the desired pattern can be realized, but the surface becomes distorted and unstable with very low yield
Solution Approach 1:
The patent applies preliminary action by forming the two-dimensional material pattern on a rigid substrate before transferring it to the flexible substrate. This sequence allows the lithography process to be performed on a stable surface, avoiding distortion, and then the completed pattern is transferred to achieve the final flexible device structure.
Solution Approach 2:
The patent uses an intermediary rigid substrate as a mediator between the lithography process and the flexible substrate. The rigid substrate serves as a stable platform for pattern formation, and the transfer process moves the completed pattern to the flexible substrate, resolving the conflict between patterning precision and surface stability.
2Ease of manufacture
If conventional transfer method with PMMA coating is used, then two-dimensional material can be transferred to target substrate, but the yield of nano or micro pattering is very low
Solution Approach 1:
The patent applies the copying principle by creating a precise pattern on a rigid substrate first, then transferring this pattern copy to the flexible substrate. This approach maintains high patterning yield because the lithography process is performed on a stable surface where precision is maintained, and the transfer step replicates the pattern without the limitations of conventional PMMA-based methods.
3Manufacturing precision
If two-dimensional material is patterned directly on flexible substrate, then the desired pattern can be achieved, but the material characteristics of flexible substrate make it difficult to realize micro- or nano-pattern
Solution Approach 1:
The patent uses preliminary action by performing the complex lithography and patterning operations on a rigid substrate first, where the flexible substrate's material characteristics do not interfere with precision. After the pattern is successfully formed, it is transferred to the flexible substrate, thus avoiding the complexity of direct patterning on flexible material while achieving high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the economical production of flexible devices with high yield and stability, suitable for applications in semiconductors, sensors, and wearable technology by patterning two-dimensional materials like graphene on flexible substrates.
Implementation Method 1
the step of removing the substrate may include a step of removing the metal substrate containing copper or nickel with ammonium persulfate, an aqueous FeCl3 solution or a strong acid
Implementation Method 2
a step of forming a micro-pattern or a nano-pattern of the two-dimensional material through a photolithography or e-beam lithography process
Data Source
AI summary
The present disclosure provides a method for manufacturing a flexible device having a pattern of a two-dimensional material formed thereon includes: a step of forming a two-dimensional material layer on a substrate; a step of forming a pattern of the two-dimensional material; a step of coating a flexible substrate solution on the patterned two-dimensional material layer and curing the same; and a step of removing the substrate.