Two-Dimensional Material Device Recess Terrace Growth

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Solution Overview

Problem

Conventional techniques fail to form large-area two-dimensional material layers at specific locations on substrates, as they are susceptible to atomic steps, making it difficult to achieve devices with good properties and requiring peeling and transfer methods that limit area expansion.

Innovation Solution

A method involving forming a recess in a substrate, widening the terrace on the recess's bottom face through step flow caused by heating, and growing a two-dimensional material layer, such as graphene, on the flat face formed, allowing for a large-area two-dimensional material layer to be created without extending over atomic steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a two-dimensional material is grown on a commercially available substrate surface, then the material can be formed, but the atomic steps and terraces on the substrate surface cause degradation of electrical properties and prevent formation of high-quality devices

Engineering Contradiction:
Improvesurface flatnessVSAvoidelectrical properties
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The substrate surface is segmented into multiple terraces at different heights, with atomic steps separating them. By controlling the inclination angle and step height, the patent creates a hierarchical structure where each terrace can be independently utilized for device formation, transforming the harmful atomic steps into a structured multi-level platform.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional surface problem to a three-dimensional solution by creating inclined surfaces and multi-level terraces. The inclination angle introduces a new spatial dimension, allowing the formation of wide flat regions that extend laterally from atomic steps, effectively adding vertical dimension control to solve the surface flatness issue.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the inclination angle from the main surface is reduced to increase terrace width, then wider terraces can be formed, but the terrace width remains limited to sub-micrometer scale

Engineering Contradiction:
Improveterrace widthVSAvoidsubstrate preparation
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent systematically varies the inclination angle parameter to control terrace width. By adjusting this geometric parameter, wide flat regions can be formed without requiring extreme angle reductions. The step height parameter is also optimized to achieve the desired terrace width while maintaining manufacturability.

Inventive Principle:
Principle #35Parameter changes

3Area of stationary object

If high-temperature treatment is applied to cause step bunching, then wider terraces can be formed, but the terrace location cannot be controlled at specific places on the substrate

Engineering Contradiction:
Improveterrace widthVSAvoidlocation control
Core Design Contradiction:
Area of stationary objectVSEase of operation

Solution Approach 1:

The inclination angle and step structure are pre-designed and prepared before high-temperature treatment. This preliminary geometric configuration ensures that when step bunching occurs during heating, the terraces form at predetermined locations with controlled widths, combining the benefits of thermal expansion with spatial precision.

Inventive Principle:
Principle #10Preliminary action

4Manufacturing precision

If a peeling and transfer method is used to form two-dimensional material on a flat face, then high-quality atomically flat material can be produced, but the material layer size is limited to about micrometer scale

Engineering Contradiction:
Improvesurface flatnessVSAvoidmaterial layer area
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The patent extracts and eliminates the atomic steps from the growth region by forming recesses that expose only flat terrace surfaces. This extraction of harmful features allows direct growth of large-area two-dimensional materials with high quality, combining the advantages of step-free surfaces with expanded area.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of high-quality, large-area two-dimensional material devices at specific locations on substrates, improving device performance by maintaining an atomically flat surface and expanding terrace width, thus overcoming the limitations of existing techniques.

Implementation Method 1

widening a terrace on a crystal surface on a bottom face of the recess by step flow caused by heating

Methodology Applied
Scientific EffectStep flow:

Implementation Method 2

forming a two-dimensional material layer made of a two-dimensional material on the flat face

Methodology Applied
Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 3

two-dimensional material layer made of a two-dimensional material that has been grown, by heating, on a bottom face of the recess

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS11651958B2Two-dimensional material device and method for manufacturing same
Publication Date: 2023.05.16 NIPPON TELEGRAPH & TELEPHONE CORP
  • US11651958B2 patent drawing
  • US11651958B2 patent drawing
  • US11651958B2 patent drawing

AI summary

By widening a terrace on a crystal surface on a bottom face of a recess by step flow caused by heating, a flat face is formed on the bottom face of the recess, a two-dimensional material layer made of a two-dimensional material is formed on the formed flat face, and then a device made of the two-dimensional material layer is produced.